This Government Contract opportunity from Department Of Commerce was posted on July 16, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
High-Precision Engineering & Technical Support Services
Contract Overview
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AI Contract Overview
The contract entails the provision of high-precision engineering consultation and technical support services specifically tailored to integrate a SiC fixture with the SUSS Gen2 Wafer Bonder. The scope includes developing and validating design specifications, conducting rigorous performance testing to ensure system compatibility, and delivering comprehensive documentation that meets technical and operational standards. The work is focused on ensuring the fixture functions reliably within the bonder’s environment, with emphasis on precision, repeatability, and process integrity for semiconductor manufacturing applications. The contract is classified as a subcontract under NAICS code 541330, issued by the Department of Commerce through NIST, with performance required in Gaithersburg, Maryland, at a zip code of 20899. Responses are due by August 3, 2026, and the solicitation was posted on July 16, 2026. While no set-aside provisions or point of contact are specified, the engagement demands expertise in advanced materials, wafer handling systems, and industrial integration, with deliverables centered on validated engineering outcomes and complete technical records to support future manufacturing and scalability efforts.
General Info
Place of Performance
Gaithersburg, MD, 20899, USASet-Aside
Documents
This scope was carved out of NIST-SS26-14.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Sources Sought Notice of Intent to Sole Source for a Closed Fixture for SUSS Wafer Bonder
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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