This Government Contract opportunity from Department Of Defense was posted on July 15, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
High-Reliability Circuit Card Assembly (CCA) Manufacturing
Contract Overview
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AI Contract Overview
The contract seeks the manufacture of 153 high-reliability circuit card assemblies to meet exacting military specifications, encompassing the full lifecycle from fabrication and component sourcing to final assembly and rigorous testing, with all units requiring compliance with MIL-STD-2073-1E packaging standards to ensure durability and environmental protection during transport and storage. The work is classified as a subcontract under a Women-Owned Small Business Set-Aside, exclusively available to eligible WOSB entities, and falls under NAICS code 334418 for other electronic component manufacturing. All deliverables must adhere to defense-grade quality and performance benchmarks, with the Department of Defense through its Maritime Supply Chain office overseeing requirements. Responses are due by July 20, 2026, following a posting date of July 15, 2026, and are to be submitted via the DIBBS platform linked in the solicitation. The contract does not specify a point of contact or a defined place of performance, implying flexibility in location provided the work meets all technical and compliance requirements. The emphasis is on verified capability to deliver fully tested, military-compliant assemblies within the tight timeframe, with no indication of option periods or phased delivery, suggesting a single, firm fixed-price procurement for the full quantity.
General Info
Agency
NAICS
Place of Performance
USASet-Aside
Documents
This scope was carved out of SPE7M1-26-U-4284.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMBLY
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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