High-Reliability PCB Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This contract involves the fabrication of high-reliability multilayer printed circuit boards that meet IPC Class 3 standards, ensuring top-tier quality and performance suited for critical applications. The scope includes impedance control and strict adherence to government design files and specifications, reflecting the precision and reliability required for Department of Defense projects. The contract is designated as a Total Small Business Set-Aside under FAR 19.5, supporting small businesses in the specialized sector of PCB manufacturing. The procurement is managed by the Department of Defense office at Hill Air Force Base, with the solicitation posted on June 3, 2026, and responses due by June 24, 2026. The NAICS code 334418 categorizes the work under electronic component manufacturing. This subcontract emphasizes high standards of quality and compliance, aiming to provide reliable circuit board solutions for defense-related applications at a key military location.
General Info
Agency
NAICS
Place of Performance
Hill Air Force Base, UT, 84056, USASet-Aside
Documents
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Timeline
Response Deadline
