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This Government Contract opportunity from Department Of Defense was posted on June 3, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

High-Reliability PCB Fabrication

Closed
Federal

Contract Overview

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This contract involves the fabrication of high-reliability multilayer printed circuit boards that meet IPC Class 3 standards, ensuring top-tier quality and performance suited for critical applications. The scope includes impedance control and strict adherence to government design files and specifications, reflecting the precision and reliability required for Department of Defense projects. The contract is designated as a Total Small Business Set-Aside under FAR 19.5, supporting small businesses in the specialized sector of PCB manufacturing. The procurement is managed by the Department of Defense office at Hill Air Force Base, with the solicitation posted on June 3, 2026, and responses due by June 24, 2026. The NAICS code 334418 categorizes the work under electronic component manufacturing. This subcontract emphasizes high standards of quality and compliance, aiming to provide reliable circuit board solutions for defense-related applications at a key military location.

General Info

Fabrication of IPC Class 3 multilayer PCBs for DoD, supporting small businesses, deadline June 24, 2026.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Hill Air Force Base, UT, 84056, USA

Set-Aside

SBA

Documents

This scope was carved out of 14860.

The full solicitation package (8 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

14860 Circuit Card Assembly

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8222 Afsc Ol H Pzie
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabrication of multilayer printed circuit boards to IPC Class 3 standards, including impedance control and compliance with government design files and specifications.

More opportunities from Department Of Defense → FA8222 Afsc Ol H Pzie

Same awarding agency

NAICS: 238220
Federal
16292 Steam Boiler Replacement
Solicitation # FA822226Q3345
Solicitation FA8222-26-Q-3345 is a firm fixed price, total small business set-aside contract for the design and construction of a replacement heating system at Building 1515, Hill Air Force Base, Utah. The project objective is to transition the facility from an existing steam heat exchanger system to a more efficient, decentralized gas-fired hot water boiler system. The scope of work includes complete mechanical, electrical, and controls engineering, the demolition and disposal of existing steam systems, and the installation of high-efficiency boilers, such as the RBI Futera III, along with necessary piping and venting. The new system must be integrated into the facility's Direct Digital Control and Energy Management Control System via BACnet. The estimated project value is between 1 million and 5 million dollars. The period of performance is weather-dependent, with design and material acquisition required before the typical April-May steam shut-off, followed by a 60-day construction window. Award may be based on either Lowest Price Technically Acceptable or Best Value Trade-Off criteria, with the latter emphasizing technical soundness and a demonstrated history of similar design-build projects. Key requirements include the provision of a Utah-licensed Professional Engineer, adherence to Davis-Bacon Act wage determinations, and compliance with Hill AFB Installation Facilities Standards. Final acceptance is contingent upon successful system commissioning, delivery of as-built drawings, and the completion of operator training for government personnel.
Plumbing, Heating, and Air-Conditioning Contractors

POSTED

8 days ago

DEADLINE

in 2 days
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