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High-Reliability PCB Fabrication

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract involves the fabrication of high-reliability multilayer printed circuit boards that meet IPC Class 3 standards, ensuring top-tier quality and performance suited for critical applications. The scope includes impedance control and strict adherence to government design files and specifications, reflecting the precision and reliability required for Department of Defense projects. The contract is designated as a Total Small Business Set-Aside under FAR 19.5, supporting small businesses in the specialized sector of PCB manufacturing. The procurement is managed by the Department of Defense office at Hill Air Force Base, with the solicitation posted on June 3, 2026, and responses due by June 24, 2026. The NAICS code 334418 categorizes the work under electronic component manufacturing. This subcontract emphasizes high standards of quality and compliance, aiming to provide reliable circuit board solutions for defense-related applications at a key military location.

General Info

Fabrication of IPC Class 3 multilayer PCBs for DoD, supporting small businesses, deadline June 24, 2026.

Agency

Department Of Defense → FA8222 Afsc Ol H Pzie

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

Hill Air Force Base, UT, 84056, USA

Set-Aside

SBA

Documents

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No documents available

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8222 Afsc Ol H Pzie
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → FA8222 Afsc Ol H Pzie
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabrication of multilayer printed circuit boards to IPC Class 3 standards, including impedance control and compliance with government design files and specifications.

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DLA Aviation

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