This Government Contract opportunity from Department Of Defense was posted on June 3, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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High-Reliability PCB Fabrication

Closed

Federal

Submission Closed06/24/2026, 04:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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AI Contract Overview

This contract involves the fabrication of high-reliability multilayer printed circuit boards that meet IPC Class 3 standards, ensuring top-tier quality and performance suited for critical applications. The scope includes impedance control and strict adherence to government design files and specifications, reflecting the precision and reliability required for Department of Defense projects. The contract is designated as a Total Small Business Set-Aside under FAR 19.5, supporting small businesses in the specialized sector of PCB manufacturing. The procurement is managed by the Department of Defense office at Hill Air Force Base, with the solicitation posted on June 3, 2026, and responses due by June 24, 2026. The NAICS code 334418 categorizes the work under electronic component manufacturing. This subcontract emphasizes high standards of quality and compliance, aiming to provide reliable circuit board solutions for defense-related applications at a key military location.

General Info

Fabrication of IPC Class 3 multilayer PCBs for DoD, supporting small businesses, deadline June 24, 2026.

Agency

Department Of Defense → FA8222 Afsc Ol H PzieView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Hill Air Force Base, UT, 84056, USA

Set-Aside

SBA

Documents

This scope was carved out of 14860.

The full solicitation package (8 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

14860 Circuit Card Assembly

AI Contract Breakdown

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Timeline

PhaseClosed

PostedJun 3

subcontract

Response DeadlineJun 24

Deadline has passed

Submission Closed

06/24/2026, 04:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → FA8222 Afsc Ol H Pzie

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → FA8222 Afsc Ol H Pzie

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Fabrication of multilayer printed circuit boards to IPC Class 3 standards, including impedance control and compliance with government design files and specifications.