This Combined Synopsis/Solicitation opportunity from Department Of Defense was posted on March 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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High-Speed Flight Data Acquisition Printed Circuit Board Assembly

Closed

W911S226U2722Federal

Submission Closed03/11/2026, 06:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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DDSP NEW CUMBERLAND FACILITY

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AI Contract Overview

The contract titled "High-Speed Flight Data Acquisition Printed Circuit Board Assembly" is a Department of Defense procurement opportunity issued by the W6QM Micc-ft Drum office located at Fort Drum, New York. It is designated as a Total Small Business Set-Aside under FAR 19.5, targeting small businesses specializing in this domain. The solicitation, identified by number W911S226U2722, was posted on March 4, 2026, with a response deadline of March 11, 2026. The procurement falls under NAICS code 334418, which relates to printed circuit assembly manufacturing. This combined-type contract focuses on the production of high-speed printed circuit board assemblies for flight data acquisition systems, indicative of highly specialized electronic manufacturing. The place of performance has a postal code of 10996, though exact city and state details are unspecified. Potential offerors or interested parties can obtain further details or submit inquiries through the primary point of contact, Jessica Kelley, whose contact information is provided. The contract is accessible online via the provided SAM.gov link for review and submission.