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Intercom Amplifier PCB Assembly

Active

Federal

Response Deadline10/15/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for the Intercom Amplifier PCB Assembly supports DLA Weapons Support ASC aviation projects through the assembly and population of printed circuit boards. The scope of work includes SMT and through-hole component placement, soldering of signal amplification circuitry, and rigorous signal integrity testing in accordance with TDP Rev B Gen 2 and drawing 81755 C8937. To execute these tasks, the contractor must utilize high-precision pick-and-place machinery and reflow ovens to deliver fully tested PCB assemblies. The opportunity is a total small business set-aside under NAICS code 334418, with performance located at Hill AFB. Strict quality and security standards are required, specifically ISO 9001:2015 certification and CMMC Level 2 compliance. Interested parties must respond by October 15, 2026.

General Info

Agency

Department Of Defense → DLA WEAPONS SUPPORT ASC SUPPLIER OPER AE AND AF DIV

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

HILL AFB, UT, 84056-5734, USA

Set-Aside

SBA

Documents

This scope was carved out of SPE4A7-27-T-0270.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

AMPLIFIER, INTERCOM, AIR

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Timeline

PostedOct 7

subcontract

Response DeadlineOct 15

Submission deadline

Response Deadline

10/15/2026, 05:00:00 PM UTCin 7 days

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Organization & Contact Information

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AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ASC SUPPLIER OPER AE AND AF DIV

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ASC SUPPLIER OPER AE AND AF DIV

Office AddressN/A

ContactsNo contact information available

Full Description

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Performs PCB assembly and population for prime contractors on DLA Weapons Support ASC aviation projects. Executes SMT and through-hole component placement, soldering of signal amplification circuitry, and signal integrity testing per TDP Rev B Gen 2 and drawing 81755 C8937. Requires high-precision pick-and-place machines and reflow ovens. Must be ISO 9001:2015 certified and CMMC Level 2 compliant. Delivers tested PCB assemblies.

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