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Lead-Free and Tin Whisker Mitigation for Electronics

Active

Federal

Response Deadline09/01/2026, 10:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The contract involves the manufacture of lead-free electronic components incorporating tin whisker mitigation techniques designed to prevent failures in military systems caused by these microscopic metallic filaments. The goal is to enhance the reliability and longevity of electronic assemblies in defense applications by addressing a known failure mechanism associated with tin whiskers in lead-free solders. Issued by the Department of Defense through Al DLA Aviation At Huntsville, this subcontract invites qualified suppliers to develop and produce components that meet stringent performance standards under NAICS code 334418. Responses are due by September 1, 2026, with the solicitation posted on June 3, 2026. While specific location details and set-aside information are not provided, the contract emphasizes the critical nature of ensuring component dependability for military hardware operating in demanding environments.

General Info

Manufacture lead-free electronic components using tin whisker mitigation for military system reliability.

Agency

Department Of Defense → Al DLA Aviation At Huntsville

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

AL

Set-Aside

NONE

Documents

(0)

No documents available

AI Contract Breakdown

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Timeline

PostedJun 3

subcontract

Response DeadlineSep 1

Submission deadline

Response Deadline

09/01/2026, 10:00:00 PM UTCin 3 months

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Organization & Contact Information

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AgencyDepartment Of Defense → Al DLA Aviation At Huntsville

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Al DLA Aviation At Huntsville

Office AddressN/A

ContactsNo contact information available

Full Description

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Manufacture of lead-free electronic components with tin whisker mitigation strategies to prevent field failures in military systems.

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