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Micro-Sized Lead-Free Solder Specimen Fabrication

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract involves the fabrication of micro-sized lead-free solder specimens specifically designed for fracture testing in advanced packaging applications. The focus is on producing specimens with precisely controlled composition and microstructure to meet the requirements for evaluating the mechanical performance of solder materials in microelectronics. This work is crucial for advancing reliable lead-free solder technologies that comply with environmental regulations and enhance device durability. Issued by the Department of Commerce's National Institute of Standards and Technology (NIST), the subcontract aims to support research and development efforts within the advanced packaging industry. The place of performance is Gaithersburg, Maryland, highlighting a location known for its concentration of scientific research. The contract aligns with NAICS code 334419, which pertains to other electronic component manufacturing, indicating that this effort supports manufacturing-related innovation.

General Info

Fabrication of lead-free micro solder specimens for fracture testing in advanced packaging, supporting R&D at NIST.

Agency

Department Of Commerce Nist

NAICS

334419 - Other Electronic Component Manufacturing View NAICS

Place of Performance

Gaithersburg, MD, 20899, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PostedMay 6

subcontract

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Organization & Contact Information

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AgencyDepartment Of Commerce Nist

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Commerce Nist

Office AddressN/A

ContactsNo contact information available

Full Description

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Production of micro-scale lead-free solder specimens with controlled composition and microstructure for fracture testing in advanced packaging applications.

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