Micro-Sized Lead-Free Solder Specimen Fabrication
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The contract involves the fabrication of micro-sized lead-free solder specimens specifically designed for fracture testing in advanced packaging applications. The focus is on producing specimens with precisely controlled composition and microstructure to meet the requirements for evaluating the mechanical performance of solder materials in microelectronics. This work is crucial for advancing reliable lead-free solder technologies that comply with environmental regulations and enhance device durability. Issued by the Department of Commerce's National Institute of Standards and Technology (NIST), the subcontract aims to support research and development efforts within the advanced packaging industry. The place of performance is Gaithersburg, Maryland, highlighting a location known for its concentration of scientific research. The contract aligns with NAICS code 334419, which pertains to other electronic component manufacturing, indicating that this effort supports manufacturing-related innovation.
General Info
Agency
NAICS
Place of Performance
Gaithersburg, MD, 20899, USASet-Aside
Documents
This scope was carved out of 1333ND26NB030008JOFOC.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Sole Source Justification for Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture
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