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Microelectronics Packaging & Assembly

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract pertains to the microelectronics packaging and assembly of fabricated dies into hermetic or non-hermetic enclosures, including ceramic DIPs and QFPs, with strict requirements to ensure precise mechanical and electrical interfaces that meet F3I compliance standards. The work involves high-precision processing to safeguard device integrity and performance under demanding operational conditions, typical of defense and aerospace applications. Managed under the Defense Logistics Agency on behalf of the Department of Defense, this subcontract falls under NAICS code 334418 for semiconductor and other electronic component manufacturing, with a posting date of July 20, 2026. The place of performance and specific office address are not specified, but the contract is accessible via the DIBBS system under award number SPE7MX24D0030, indicating it is part of a broader defense supply chain effort focused on mission-critical electronic component fabrication.

General Info

Microelectronics packaging for defense applications under F3I standards, NAICS 334418, DLA-managed, award SPE7MX24D0030.

Agency

Department Of Defense → Defense Logistics Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7MX-23-R-0078.

The full solicitation package (6 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITA

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Timeline

PostedJul 20

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Defense Logistics Agency

Office AddressN/A

ContactsNo contact information available

Full Description

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Package fabricated dies into hermetic or non-hermetic enclosures such as ceramic DIPs and QFPs, ensuring precise mechanical and electrical interfaces for F3I compliance.

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