Microfabrication of Electroplated Copper Micro Specimens

This contract involves the design and fabrication of free-standing micro-scale copper specimens with highly controlled geometry, microstructure, and grain size to closely mimic semiconductor interconnects for mechanical testing purposes. The work requires precision microfabrication techniques, focusing on electroplated copper to replicate the physical and material properties of actual semiconductor components used in reliability assessments. The ultimate goal is to provide accurate test specimens that can aid in advancing the understanding of mechanical behavior in microelectronic materials. The subcontract is issued by the Department of Commerce, specifically the National Institute of Standards and Technology (NIST), with the place of performance located in Gaithersburg. The solicitation aligns with NAICS code 334418, indicating a focus on electronic instrument manufacturing. This effort supports the development of standardized testing methodologies by ensuring that specimens closely replicate real-world interconnect conditions at the micro-scale level.