MIL-SPEC Electronic Component Packaging and Shipping
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract for the DLA Weapons Support Active Devices Division involves providing specialized packaging and labeling services for microcircuits to support prime contractors. The scope of work requires strict adherence to MIL-PRF-81705 for ESD and EMI protection, MIL-STD-129 for shipment marking, and IPC/JEDEC J-STD-609 for lead finish labeling. All materials used must be ESD-safe and provide necessary EMI shielding to ensure components are delivered shipment-ready. The project is managed under NAICS code 488410 and will be performed in Columbus, Ohio. Due to the nature of the components, the contractor must maintain full ITAR and EAR compliance for all handling and processing. Interested parties must respond by October 26, 2026.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-27-T-0961.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITAL
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