MIL-SPEC Electronic Packaging Services

The MIL-SPEC Electronic Packaging Services subcontract, issued by the Department of Defense Active Devices Division, involves providing specialized packaging, marking, and cushioning for semiconductor components intended for prime contractors on DLA supply contracts. The work is performed at Hill AFB and requires strict adherence to military standards, specifically MIL-STD-2073-1E for packaging, MIL-STD-129 for marking, and IPC/JEDEC J-STD-609 for labeling. To ensure component integrity, the contractor must operate within an ESD-safe environment using MIL-PRF-81705 barrier materials and A-A-59136 cushioning. The final deliverable consists of fully packaged and labeled units prepared for First Destination Transportation. This opportunity falls under NAICS code 561910, with a response deadline of October 5, 2026.