This Government Contract opportunity from Department Of Defense was posted on October 12, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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MIL-SPEC Packaging and Preservation Services

Closed

Federal

Submission Closed10/23/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

This subcontract for MIL-SPEC Packaging and Preservation Services supports the Department of Defense through the DLA Weapons Support Active Devices Division. The contractor is responsible for providing specialized preservation and packaging for semiconductor components, ensuring all work adheres to strict military standards including MIL-DTL-19491 for preservation, MIL-STD-129 for shipment markings, and MIL-STD-2073-1E for packaging data. To achieve these requirements, the provider must utilize vacuum sealing equipment, ESD-safe materials, and moisture-barrier bags to deliver shipment-ready components. The project is categorized under NAICS code 339999 and will be performed at Robins Air Force Base. Interested parties should note the posting date of October 12, 2026, with a response deadline set for October 23, 2026.

General Info

MIL-SPEC packaging and preservation for DoD semiconductor components at Robins Air Force Base.

Agency

Department Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

NAICS

339999 - All Other Miscellaneous Manufacturing

Place of Performance

ROBINS A F B, GA, 31098-1887, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-27-T-0500.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE, DIODE

AI Contract Breakdown

Uniform Contract Format

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Timeline

PhaseClosed

PostedOct 12

subcontract

Response DeadlineOct 23

Deadline has passed

Submission Closed

10/23/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Performs specialized preservation and packaging for prime contractors on DLA Weapons Support Active Devices Division projects. Executes semiconductor preservation per MIL-DTL-19491, shipment markings per MIL-STD-129, and packaging data per MIL-STD-2073-1E. Utilizes moisture-barrier bags, ESD-safe materials, and vacuum sealing equipment. Delivers fully preserved and marked semiconductor components ready for shipment.