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Military-Compliant Packaging and Preservation Services

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract involves providing preservation, packaging, and packing services for electronic components in strict compliance with MIL-STD-2073-1 standards. The scope includes specialized techniques such as vacuum sealing, the use of desiccants to control moisture, and employing qualified barrier materials to ensure the integrity and protection of sensitive electronic parts. These measures are critical for maintaining component reliability during storage and transportation. The contract is identified as a subcontract request under NAICS code 385210 and is managed by the Department of Defense through the Navsup Weapon Systems Support Mech agency. The designated location for performance is Fairless Hills, Pennsylvania, with the zip code 19030. The solicitation was posted on April 6, 2026, emphasizing the need for military-compliant packaging solutions tailored to the stringent requirements of defense-related electronic components.

General Info

Provide MIL-STD-2073-1 compliant packaging and preservation services for electronic components in Pennsylvania.

Agency

Department Of Defense → Navsup Weapon Systems Support Mech

NAICS

385210

Place of Performance

Fairless Hills, PA, 19030, USA

Set-Aside

NONE

Documents

This scope was carved out of N0010426PUA90.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

DISCRETE INPUT 64CH

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Timeline

PostedApr 6

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Navsup Weapon Systems Support Mech

Office AddressN/A

ContactsNo contact information available

Full Description

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Provide MIL-STD-2073-1 compliant preservation, packaging, and packing for electronic components, including vacuum sealing, desiccants, and use of qualified barrier materials.

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