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Military Packaging and Preservation Services

Active

Response Deadline09/25/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract for Military Packaging and Preservation Services is issued by the Department of the Navy through the Pa DLA Aviation At Philadelphia. The contractor is responsible for the preservation, packaging, packing, and marking of circuit card assemblies to ensure full compliance with MIL-STD-2073-1 for military distribution, specifically covering Level A and Level B packing configurations. The project is based in Philadelphia, Pennsylvania, under NAICS code 493190. Interested parties must submit their responses by the deadline of September 25, 2026, at 8:30 PM.

General Info

Navy subcontract for military packaging of circuit card assemblies in Philadelphia by September 2026.

Agency

Department Of The Navy → Pa DLA Aviation At PhiladelphiaView Agency

NAICS

493190 - Other Warehousing and StorageView NAICS

Place of Performance

PHILADELPHIA, PA, 19111-5098, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRPA126QZB87.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB — 5998016218637 — SPRPA126QZB87

AI Contract Breakdown

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Timeline

PostedAug 26

subcontract

Response DeadlineSep 25

Submission deadline

Response Deadline

09/25/2026, 08:30:00 PM UTCin 30 days

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Organization & Contact Information

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AgencyDepartment Of The Navy → Pa DLA Aviation At Philadelphia

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of The Navy → Pa DLA Aviation At Philadelphia

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Provide preservation, packaging, packing, and marking of circuit card assemblies in compliance with MIL-STD-2073-1 for military distribution, including Level A and Level B packing configurations.

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