Open-Standard Interconnect Development (UCIe Compliance)

The contract seeks the development or integration of UCIe-compliant interface IP to enable seamless die-to-die interoperability among chiplets adhering to open industry standards. The focus is on creating or incorporating semiconductor interface technology that meets the Universal Chiplet Interconnect Express specification, ensuring compatibility, high bandwidth, and low latency across disaggregated chiplet architectures in advanced packaging environments. Success requires demonstrated expertise in physical and protocol layer design, adherence to UCIe specifications, and validation of interoperability with existing industry-compliant components. This is a subcontract under the Department of Defense’s FA8002 Saf Aq office, with a NAICS code of 334418 indicating activity in semiconductor and related electronic component manufacturing. The opportunity was posted on July 8, 2026, and responses are due by July 23, 2026, with no set-aside provisions specified. The place of performance and point of contact details are not provided, and the work is expected to support DoD initiatives in next-generation microelectronics, emphasizing supply chain resilience and technological leadership through open-standard interconnect solutions.