This Government Contract opportunity from Department Of Defense was posted on July 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Packaging and Encapsulation of Microcircuit

Closed

Federal

Submission Closed07/16/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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ELECTRONIC MODULE, STAN

Solicitation # SPE7M5-27-T-0997

Solicitation SPE7M5-27-T-0997, issued by the DLA Weapons Support Active Devices Division, is a request for quotations for one standardized electronic module, NSN 5963013531602. The requirement specifies that the item must meet the degree of interchangeability defined in MIL-STD-280A PARA.3.2.1.ALT and requires the bidder to provide a Certificate of Compliance and supporting data. The manufacturer's inspection system must comply with SAE AS9003 or ISO 9001 tailored to SAE AS9003, with sampling conducted per MIL-STD-1916, ASQ H1331, or a comparable zero-based sampling plan. Delivery is required within 20 days to the USS SEAWOLF SSN 21 via the fastest traceable means, with inspection and acceptance occurring at the destination. The contract mandates strict adherence to environmental and safety standards, including a prohibition on Class I ozone-depleting substances and the intentional addition of mercury. Rigorous packaging requirements are in place to prevent damage to leads and terminals, specifically requiring DOD qualified Electrostatic Discharge and Electromagnetic Interference protective materials per MIL-PRF-81705 and marking in accordance with MIL-STD-129. Administrative requirements include CMMC Level 2 Self-Assessment, Buy American Act compliance, and the use of the Wide Area Workflow system for invoicing. Offers involving additive manufacturing are ineligible for award.

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Solicitation # SPE7M5-27-T-1560

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about 17 hours ago

DEADLINE

in 12 days

AI Contract Overview

The contract requires the hermetic or plastic packaging of microcircuits in full compliance with military standards, encompassing all critical fabrication steps including lead framing, die attach, wire bonding, and final sealing. The work must be executed to meet stringent performance and reliability requirements typical of defense-grade electronics, ensuring the packaged components can withstand harsh environmental conditions and operational stress. This subcontract is focused on advanced microcircuit encapsulation services with no flexibility in meeting specified military specifications, and all processes must be verified and documented to ensure traceability and quality control. The solicitation, issued by the Active Devices Division under the Department of Defense, has a response deadline of July 16, 2026, and is targeted at qualified subcontractors capable of performing the work at the specified place of performance in Columbus, Ohio, with a zip code of 43213. The NAICS code 334418 indicates the category of semiconductor and related device manufacturing, underscoring the technical expertise required. All submissions must align with the stringent expectations of the defense supply chain, though no set-aside provisions are specified, meaning any eligible contractor may respond. The contract is posted on the DIBBS platform and requires full compliance with federal procurement guidelines for defense-related subcontracting.