Packaging and Encapsulation of Microcircuit

The contract requires the hermetic or plastic packaging of microcircuits in full compliance with military standards, encompassing all critical fabrication steps including lead framing, die attach, wire bonding, and final sealing. The work must be executed to meet stringent performance and reliability requirements typical of defense-grade electronics, ensuring the packaged components can withstand harsh environmental conditions and operational stress. This subcontract is focused on advanced microcircuit encapsulation services with no flexibility in meeting specified military specifications, and all processes must be verified and documented to ensure traceability and quality control. The solicitation, issued by the Active Devices Division under the Department of Defense, has a response deadline of July 16, 2026, and is targeted at qualified subcontractors capable of performing the work at the specified place of performance in Columbus, Ohio, with a zip code of 43213. The NAICS code 334418 indicates the category of semiconductor and related device manufacturing, underscoring the technical expertise required. All submissions must align with the stringent expectations of the defense supply chain, though no set-aside provisions are specified, meaning any eligible contractor may respond. The contract is posted on the DIBBS platform and requires full compliance with federal procurement guidelines for defense-related subcontracting.