This Government Contract opportunity from Department Of Defense was posted on May 11, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
PCB Assembly and Subcomponent Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract pertains to the fabrication and assembly of printed circuit boards and electronic subcomponents intended for integration into a communications interface unit, requiring precise manufacturing standards and technical compliance. The work falls under NAICS code 334418, indicating specialization in electronic component manufacturing, and is structured as a subcontract under the Department of Defense, specifically managed by the ASC SUPPLIER OPER AE AND AF DIV. Performance is expected to meet stringent defense-grade specifications, though the exact location of performance is not specified. The solicitation was posted on May 11, 2026, with a response deadline of May 19, 2026, providing a limited window for qualified vendors to submit proposals. Bidders must possess demonstrated capability in electronic assembly, quality control, and supply chain reliability suitable for defense applications. The absence of set-aside details suggests this opportunity is open to general industry participation without reserved status for small or disadvantaged businesses. Interested parties must access the official DIBBS portal via the provided link to obtain full solicitation details and submit responses in accordance with procedural requirements.
General Info
Agency
NAICS
Place of Performance
USASet-Aside
Documents
This scope was carved out of SPE4A7-26-T-333H.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
INTERFACE UNIT, COMM
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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