This Government Contract opportunity from Department Of Defense was posted on May 11, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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PCB Assembly and Subcomponent Fabrication

Closed

Federal

Submission Closed05/19/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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14860 Circuit Card AssemblyThis contract establishes a five-year Blanket Purchase Agreement (BPA) to provide the 516th CAPRE and related missions with efficient procurement and manufacturing services for Printed Circuit Board Assemblies (PCBAs) and Circuit Card Assemblies (CCAs). The contract aims to support design, prototyping, and operational requirements while addressing electronic obsolescence and modernization efforts within the Department of War. It is a Total Small Business Set-Aside under the NAICS code 334418 and is managed by the Department of Defense at Hill Air Force Base, Utah. The solicitation was posted on June 3, 2026, with proposals due by June 24, 2026. The contracting office responsible is FA8222 Afsc Ol H Pzie. Primary and secondary points of contact are available for communication regarding this procurement. The contract vehicle is designed to ensure rapid production and acquisition of high-quality electronic assemblies critical for ongoing and future defense operations.

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UNIVERSITY of SOUTHERN MISSISSIPPI

POSTED

2 days ago

DEADLINE

in 20 days

AI Contract Overview

The contract involves the fabrication and assembly of printed circuit boards (PCBs) and electronic subcomponents, which are to be integrated into a communications interface unit. It is a subcontract issued by the Department of Defense through the ASC Supplier Operation AE and AF Division. The work falls under NAICS code 334418, which pertains to electronic component manufacturing. The solicitation was posted on May 11, 2026, with a response deadline set for May 19, 2026, indicating a concise window for potential bidders to submit their proposals. Details regarding the specific location of the performance or the contracting office contact information are not provided, suggesting potential responders would access further information through the designated online link. This subcontract focuses on supplying critical electronic assemblies that are essential for communication systems, highlighting the precision and specialized manufacturing required in defense-related electronics projects.

General Info

Subcontract for fabricating and assembling PCBs for DoD communication systems; bid deadline May 19, 2026.

Agency

Department Of Defense → ASC SUPPLIER OPER AE AND AF DIV

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PhaseClosed

PostedMay 11

subcontract

Response DeadlineMay 19

Deadline has passed

Submission Closed

05/19/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ASC SUPPLIER OPER AE AND AF DIV

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ASC SUPPLIER OPER AE AND AF DIV

Office AddressN/A

ContactsNo contact information available

Full Description

Fabrication and assembly of printed circuit boards and electronic subcomponents for integration into the communications interface unit.

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