This Government Contract opportunity from Department Of Defense was posted on June 3, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
PCB Assembly (IPC Class 2)
Contract Overview
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AI Contract Overview
This contract involves the full assembly of printed circuit boards (PCBs) using tin-lead (Sn-Pb) solder, incorporating surface mount technology (SMT), through-hole, and hybrid soldering methods. The assembly work must comply with the IPC-A-610 Class 2 standards, ensuring a specified quality level suitable for dedicated service environments. The contract is designated as a total small business set-aside under FAR 19.5 and falls within the NAICS code 334418, which covers electronic component manufacturing. The contract was posted on June 3, 2026, with a response deadline of June 24, 2026, at 4:00 pm. It is a subcontract opportunity issued by the Department of Defense, specifically under the FA8222 Office at Hill Air Force Base, Utah, with the zip code 84056 as the place of performance. This opportunity is targeted to small businesses, emphasizing compliance with government standards for quality and precision in electronic assembly.
General Info
Agency
NAICS
Place of Performance
Hill Air Force Base, UT, 84056, USASet-Aside
Documents
This scope was carved out of 14860.
The full solicitation package (8 documents), including the RFP, is on the prime solicitation, not on this scope.
14860 Circuit Card Assembly
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → FA8222 Afsc Ol H Pzie
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