PCB Assembly (IPC Class 2)

This contract involves the full assembly of printed circuit boards (PCBs) using tin-lead (Sn-Pb) solder, incorporating surface mount technology (SMT), through-hole, and hybrid soldering methods. The assembly work must comply with the IPC-A-610 Class 2 standards, ensuring a specified quality level suitable for dedicated service environments. The contract is designated as a total small business set-aside under FAR 19.5 and falls within the NAICS code 334418, which covers electronic component manufacturing. The contract was posted on June 3, 2026, with a response deadline of June 24, 2026, at 4:00 pm. It is a subcontract opportunity issued by the Department of Defense, specifically under the FA8222 Office at Hill Air Force Base, Utah, with the zip code 84056 as the place of performance. This opportunity is targeted to small businesses, emphasizing compliance with government standards for quality and precision in electronic assembly.