PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD

The contract requests proposals for the fabrication and assembly of an HPSC processor card under solicitation number 80NSSC26939777Q-R1, with a strict deadline of August 11, 2026, at 8:00 PM Eastern Time. This is a Small Business Set Aside, meaning only small businesses are eligible to respond, and the North American Industry Classification System code is 334418, which pertains to other electronic component manufacturing. All vendors must reference the Notice ID when submitting their proposals and are required to review the attached Statement of Work and Request for Quotation for detailed technical and procedural requirements. The opportunity is managed by the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration, with the point of contact being Cody Guidry, reachable at [email hidden]. The award will be administered from the Stennis Space Center in Mississippi, though the specific place of performance is not defined. Proposals must be submitted through the SAM.gov portal linked in the posting.