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PCB Fabrication (Bare Board Manufacturing)

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the manufacture of bare printed circuit boards for use in printed circuit board assembly production, encompassing a full range of fabrication processes including design for manufacturability review, etching, plating, solder mask application, silkscreen printing, and electrical testing to ensure performance and reliability. The work is performed under a subcontract classified under NAICS code 334418 and is administered by the Defense Logistics Agency on behalf of the Department of Defense, with performance requirements aligned to military and defense standards. All fabricated boards must meet exacting quality and functional specifications to support mission-critical components, and manufacturing must occur in compliance with industry best practices and defense supply chain integrity protocols. The solicitation was posted on July 14, 2026, and the contract is referenced under award number SPE7M126P2387.

General Info

Manufacture of bare PCBs for defense use under DLA oversight, complying with military standards and quality protocols.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M126P2387.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufacture of bare printed circuit boards including DFM review, etching, plating, solder mask, silkscreen, and electrical testing for use in CCA production.

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