PCB Fabrication
Contract Overview
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AI Contract Overview
This subcontract, issued by the Defense Logistics Agency under the Department of Defense, focuses on the fabrication of printed circuit board substrates. The scope of work involves specialized manufacturing processes that may include multi-layer construction, precise impedance control, and the application of high-reliability finishes to meet rigorous technical standards. Classified under NAICS code 334419, the agreement was posted on July 13, 2026. The contract ensures the production of critical electronic components necessary for defense applications, emphasizing technical precision and reliability in the manufacturing of the substrates.
General Info
Place of Performance
Not specifiedSet-Aside
Documents
This scope was carved out of SPE7M0-25-T-235K.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
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