PCB Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract opportunity with the Department of Defense, specifically through DLA Aviation in Oklahoma City, focuses on the manufacture of bare printed circuit boards. The required deliverables include boards with specific stack-up, impedance control, and surface finishes such as ENIG or HASL, all designed for use in high-reliability circuit card assembly applications. The solicitation is categorized under NAICS code 334416 and was posted on August 14, 2026. Interested parties must submit their responses by the deadline of September 15, 2026, at 04:59:00 UTC.
General Info
Agency
NAICS
Place of Performance
OK, USASet-Aside
Documents
This scope was carved out of SPRTA126Q2063.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMBLY
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Timeline
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Organization & Contact Information
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