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PCBA Assembly

Active

Federal

Response Deadline10/20/2026, 04:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity with the Department of Defense, specifically for DLA Aviation in Oklahoma City, involves the assembly of printed circuit board assemblies for prime contractors. The scope of work includes executing both SMT and through-hole soldering of components to produce assembled circuit card assemblies tailored for aviation applications. The project falls under NAICS code 334418 and was posted on September 18, 2026. Interested parties must submit their responses by the deadline of October 20, 2026.

General Info

DOD subcontract for aviation printed circuit board assembly; responses due October 20, 2026.

Agency

Department Of Defense → Ok DLA Aviation At Oklahoma CityView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

OK, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRTA1-26-Q-0480.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

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Timeline

PostedSep 18

subcontract

Response DeadlineOct 20

Submission deadline

Response Deadline

10/20/2026, 04:59:00 AM UTCin about 1 month

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Organization & Contact Information

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AgencyDepartment Of Defense → Ok DLA Aviation At Oklahoma City

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Ok DLA Aviation At Oklahoma City

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Office AddressN/A

ContactsNo contact information available

Full Description

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Performs PCBA assembly for prime contractors on DLA Aviation projects. Executes SMT and through-hole soldering of components onto printed circuit boards for aviation applications. Delivers assembled circuit card assemblies.

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