PCBA Teardown, Repair, and RFI Restoration
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract for the Department of the Navy's Navsup Weapon Systems Support involves the teardown, evaluation, repair, overhaul, and modification of flight-critical Printed Board Assemblies. The selected contractor will be responsible for disassembling, cleaning, inspecting, and replacing components in accordance with TDP VER 001 and REF NR 8430022-502 to deliver eight Ready for Issue board assemblies. Work will be performed in Philadelphia and requires the use of precision soldering tools and diagnostic equipment. To be eligible, the contractor must be a Government-approved source holding either ISO 9001 or AS9100 certification. The project falls under NAICS code 334418, with a response deadline set for October 30, 2026.
General Info
Place of Performance
PHILADELPHIA, PA, 19111-5098, USASet-Aside
Documents
This scope was carved out of N0038327QSA01.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
NRP,PRINTE DBRD ASS — 5998016636129 — N0038327QSA01
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Timeline
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Organization & Contact Information
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