Photonics Component Design and Fabrication
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract for the Office of the Secretary of Defense focuses on the design and fabrication of photonic components for infrared imaging projects. The scope of work involves developing photonic integrated circuits, waveguide designs, and optical interfaces intended for co-packaging with digital circuits. These activities require the use of specialized cleanroom facilities and lithography equipment to produce fabricated photonic prototypes and detailed technical design reports, all while adhering to strict government inspection and evaluation standards. The opportunity is designated as a total small business set-aside under the SBIR/STTR mandate, requiring the contractor to have fewer than 500 employees. It falls under NAICS code 333311 and is managed by the U.S. Department of Defense. Interested parties must submit their responses by September 9, 2026.
General Info
Agency
NAICS
Place of Performance
Not specifiedSet-Aside
Documents
This scope was carved out of OSW26BZ05-NV021.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Co-packaging Digital Readout Integrated Circuits and Photonics for Advanced Infrared Imaging
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