This Government Contract opportunity from Department Of Defense was posted on August 9, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Preservation and Dry Storage Packaging
Contract Overview
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AI Contract Overview
The contract pertains to the cleaning, drying, and preservation of microcircuits using preservation code GX in full compliance with DLA packaging standards, ensuring long-term protection and readiness of sensitive electronic components. All work must be performed to meet rigorous federal specifications for environmental and handling controls, with a focus on preventing corrosion, moisture damage, and contamination during storage and transport. The performance location is designated as Columbus, Ohio, with the zip code 43213, indicating that all operations must be executed at or shipped to this site under the oversight of the Active Devices Division within the Department of Defense. This action is classified as a subcontract under NAICS code 332999, which covers other electrical equipment and component manufacturing, and is open for response until August 20, 2026. The solicitation was posted on August 9, 2026, through the DIBBS system, providing suppliers and contractors with the opportunity to bid for work supporting critical defense electronics logistics. There is no set-aside designation specified, meaning the contract is open to all qualified vendors regardless of business size or category. Compliance with DLA packaging requirements is mandatory, and adherence to preservation code GX is essential for ensuring the functionality and longevity of the microcircuits in storage until deployment.
General Info
Agency
NAICS
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-397W.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITA
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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