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Printed Circuit Board Assembly (PCBA) Manufacturing

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract with the Defense Logistics Agency under the Department of Defense focuses on the full build-to-print manufacturing of military-grade printed circuit board assemblies. The scope of work encompasses the entire production lifecycle, including component sourcing, surface mount technology assembly, rigorous inspection, and comprehensive testing to ensure military specifications are met. Classified under NAICS code 334418, the project is managed by the Defense Logistics Agency. The contract ensures the delivery of high-reliability electronic assemblies required for defense applications, emphasizing a complete end-to-end manufacturing process from raw component procurement to final quality validation.

General Info

DLA subcontract for full build-to-print manufacturing of military-grade printed circuit board assemblies.

Agency

Department Of Defense → Defense Logistics AgencyView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-26-T-064U.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

NRP, SW BOARD ASSY A

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Timeline

PostedAug 17

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Defense Logistics Agency

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Full build-to-print manufacturing of military-grade circuit board assemblies including component sourcing, SMT assembly, inspection, and testing.

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