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Printed Circuit Board Assembly (PCBA)

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract pertains to the design, fabrication, and assembly of printed circuit boards for use in ambient temperature sensor units, with responsibilities spanning signal conditioning, power regulation, and output interface functions. The work is classified under NAICS code 334418, indicating it involves electronic component and product manufacturing, specifically tailored for defense-grade sensor systems. As a subcontract under the Department of Defense, managed by the Defense Logistics Agency, the performance location and specific delivery details are unspecified, but the technical scope demands precise engineering to meet rigorous environmental and operational standards expected in military applications. The contract was publicly posted on July 21, 2026, under solicitation reference SPE4A526P2845, though no set-aside designation or small business preference is indicated. The absence of detailed point of contact or geographic performance data suggests the work may be distributed across multiple vendor facilities under centralized oversight. The integration of PCBs into temperature sensing units implies a focus on reliability, thermal stability, and long-term performance in austere conditions, aligning with Defense Logistics Agency's broader mission to support operational readiness through secure and robust electronics manufacturing.

General Info

Design, fabricate, and assemble defense-grade PCBs for ambient temperature sensors under DLA oversight.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE4A5-26-Q-0138.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

66--SENSOR,AMBIENT TEMP

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Design, fabrication, and assembly of PCBs for signal conditioning, power regulation, and output interfaces in ambient temperature sensor units.

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