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This Government Contract opportunity from Department Of Defense was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Printed Circuit Board (PCB) Assembly and Subcomponent Fabrication

Closed
Federal

Contract Overview

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This contract involves the sub-tier fabrication and assembly of printed circuit boards (PCBs) and electronic subassemblies specifically used within indicator panels. The scope of work includes sourcing of components, soldering processes, thorough testing, and ensuring complete traceability throughout the production cycle. The contract is managed by the Defense Logistics Agency under the Department of Defense and pertains to the NAICS code 334418, which covers electronic component manufacturing. The solicitation was posted on May 28, 2026, with responses due by June 2, 2026. While specific location details and points of contact are not provided, the work is classified as a subcontract opportunity. This contract requires manufacturers with capabilities in PCB assembly and electronic subcomponent fabrication to meet strict quality and traceability standards, critical for defense-related indicator panel applications.

General Info

Subcontract for PCB fabrication, assembly, testing, and traceability for defense indicator panels.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE4A5-26-T-176A.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

PANEL, INDICATOR

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Sub-tier fabrication and assembly of PCBs and electronic subassemblies used within the indicator panel, including component sourcing, soldering, testing, and traceability.

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