This Government Contract opportunity from Department Of Defense was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Printed Circuit Board (PCB) Assembly and Subcomponent Fabrication
Contract Overview
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This contract involves the sub-tier fabrication and assembly of printed circuit boards (PCBs) and electronic subassemblies specifically used within indicator panels. The scope of work includes sourcing of components, soldering processes, thorough testing, and ensuring complete traceability throughout the production cycle. The contract is managed by the Defense Logistics Agency under the Department of Defense and pertains to the NAICS code 334418, which covers electronic component manufacturing. The solicitation was posted on May 28, 2026, with responses due by June 2, 2026. While specific location details and points of contact are not provided, the work is classified as a subcontract opportunity. This contract requires manufacturers with capabilities in PCB assembly and electronic subcomponent fabrication to meet strict quality and traceability standards, critical for defense-related indicator panel applications.
General Info
Agency
NAICS
Place of Performance
USASet-Aside
Documents
This scope was carved out of SPE4A5-26-T-176A.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
PANEL, INDICATOR
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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