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Printed Circuit Board (PCB) Fabrication with Resin Substrate

Active

Federal

Response Deadline06/18/2026, 04:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This contract involves the design and fabrication of high-reliability printed circuit boards made from resin substrates, intended specifically for use in bleed air pressure indicator units. It is a subcontract opportunity issued by the Department of Defense through the Ok DLA Aviation office in Oklahoma City. The work focuses on producing durable and precise PCBs that meet stringent quality requirements for aerospace applications. The contract is classified under the NAICS code 334418, which pertains to electronic component manufacturing. Although no specific solicitation number or set-aside type is provided, interested parties are required to respond by the deadline of June 18, 2026. Details about the place of performance and point of contact are not specified, but the contract posting date is June 2, 2026. This opportunity represents a critical supply component for defense-related aviation systems, emphasizing reliability and advanced materials in the fabrication process.

General Info

Design and fabrication of high-reliability resin PCB for bleed air pressure indicators, DoD subcontract.

Agency

Department Of Defense → Ok DLA Aviation At Oklahoma City

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

OK, USA

Set-Aside

NONE

Documents

(0)

No documents available

AI Contract Breakdown

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Timeline

PostedJun 2

subcontract

Response DeadlineJun 18

Submission deadline

Response Deadline

06/18/2026, 04:59:00 AM UTCin 1 day

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Organization & Contact Information

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AgencyDepartment Of Defense → Ok DLA Aviation At Oklahoma City

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Ok DLA Aviation At Oklahoma City

Office AddressN/A

ContactsNo contact information available

Full Description

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Design and fabrication of high-reliability resin-based printed circuit boards for integration into bleed air pressure indicator units.

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