This Government Contract opportunity from Department Of Defense was posted on June 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Printed Circuit Board (PCB) Fabrication with Resin Substrate

Closed

Federal

Submission Closed06/18/2026, 04:59:00 AM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

This contract involves the design and fabrication of high-reliability printed circuit boards made from resin substrates, intended specifically for use in bleed air pressure indicator units. It is a subcontract opportunity issued by the Department of Defense through the Ok DLA Aviation office in Oklahoma City. The work focuses on producing durable and precise PCBs that meet stringent quality requirements for aerospace applications. The contract is classified under the NAICS code 334418, which pertains to electronic component manufacturing. Although no specific solicitation number or set-aside type is provided, interested parties are required to respond by the deadline of June 18, 2026. Details about the place of performance and point of contact are not specified, but the contract posting date is June 2, 2026. This opportunity represents a critical supply component for defense-related aviation systems, emphasizing reliability and advanced materials in the fabrication process.