Quantum Photonic Chip Design & Fabrication

This contract involves the design and fabrication of integrated photonic circuits specifically for quantum interconnect applications. The work focuses on developing components such as on-chip light sources, detectors, and low-loss waveguides to enable efficient and reliable quantum communication technologies. The project will be conducted as a subcontract under the National Science Foundation's Directorate For Technology, Innovation, & Partnerships, with the place of performance in Alexandria. The solicitation was posted in mid-May 2026, with responses due by late July 2026, and falls under the NAICS code 334418, related to semiconductor manufacturing. The contract aims to advance key technology elements crucial to quantum photonic chips, facilitating integration and improved performance for quantum systems. The initiative represents a targeted effort to push forward innovation in quantum hardware by combining state-of-the-art design and fabrication capabilities. This opportunity is poised to support developments that could significantly impact the field of quantum communication and computing through enhanced photonic interconnect components.