REQUEST FOR INFORMATION (RFI)/SOURCES SOUGHT - RADIATION HARDENED FIELD PROGRAMMABLE GATE ARRAY

N00164-19-S-NC23- REQUEST FOR INFORMATION (RFI)/SOURCES SOUGHT - RADIATION HARDENED FIELD PROGRAMMABLE GATE ARRAY - FSC 5999 - NAICS 334511 Issue Date: 27 AUGUST 2019 - Closing Date: 09 OCTOBER 2019 - 4:00 PM EDT REQUEST FOR INFORMATION (RFI) / SOURCES SOUGHT - The government is issuing this request for information / sources sought as part of market research for the development and production of radiation-hardened (Rad-Hard) microcircuits and architectures that can be utilized to develop a strategically rad-hard field programmable gate array (FPGA). Rad-hard architectures that use commercial FPGAs to meet the capabilities defined in this request for information (RFI) will also be considered. The DoD's major technical objectives of this RFI are to determine the feasibility of designing and building a Rad-Hard FPGA along with a roadmap to maturation for the possibility of production in the future. The respondent(s) will provide a cost estimate for the design and fabrication of a future FPGA device with the minimum capabilities shown in Table 1. The primary purpose of this RFI is to determine technical feasibility and provide insight into the architecture, hardening techniques, and approximate cost that will be required to meet these technical objectives. The government is interested in the implementation of an architecture and any techniques that will enable the FPGA device to operate without degradation in the environments described in Table 2 without requiring any external redundant hardware. For the dose-rate environments listed in Table 2, it is required that the device withstand "survival" radiation event levels without damage or permanent loss of functionality. Moreover, the device must either (option 1) operate during and through these event levels and continue to function as designed (preferred) or (option 2) have the ability to incorporate Circumvention and Recovery (C&R) functionality above the "upset" radiation event levels shown in Table 2 subject to the full device restoration speeds listed in the table. In this case, the device would be expected to operate without upset when exposed to dose-rate events below these levels. The Government desires information on FPGA solutions that meet or exceeds parameters identified in Table 1 and Table 2. Success criteria would be the development of an architecture and necessary test circuit with improved Rad-Hard microelectronic capabilities, for example and including: - Demonstration that IP developed for a space-hardened FPGA can meet strategic program needs - Development of new radiation-hardened IP that can be utilized in a future Rad Hard FPGA TABLE 1. SEE ATTACHMENT 1 TABLE 2. SEE ATTACHMENT 1 Parties interested in responding should include the following in their response: - Name/Type of Technology - Technology Maturity: Existing technology or technology concept - Technology summary covering technical approach, operating principles, testing conducted to date, and commercial sales, if any. - Approximate cost and time required to deliver a prototype rad-hard FPGA that meets the stated requirements in Tables 1 and 2 - A roadmap and cost estimate for the FPGA technology maturation and product qualification Formal response to this RFI should identify the intended technology solution by name, describing the type of technology it is (i.e. bulk CMOS, CMOS/SOI, BiCMOS, etc.) including minimum feature size currently available in mature commercial (equivalent) FPGA device families. Key process features should be described that are relevant to meeting combined performance and radiation hardness requirements or goals. Specific process features that have been selected or tailored to improve radiation hardness, or relevant to this objective should be highlighted; identifying the expected improvements in such hardness based on underlying basic mechanisms of radiation/device interaction and degradation. Supporting test data should be provided or referenced for the specified (starting point) technology, as further evidence of measured performance and radiation hardness levels. Independent (third party) radiation test data for such starting point technologies is also encouraged for this purpose. When citing supporting test data, the response should include the specific test environment (effect), when such testing was completed, sample size, radiation test levels and facility; and any established Mil standard test methods followed (or adhered to) during such testing. Starting point technology maturity should be provided based on the "nine Technology Readiness Levels (TRL) of the DoD (see https://techlinkcenter.org/technology-readiness-level-dod/). Expected TRL maturity upon program completion should also be provided, with technical basis of such (predicted) improvements or progression, based on the technical approach defined in the formal response. Formal response should also cite specific parts and their performance capabilities that are commercially available; including any products that are "Space-hardened" or "Space- Tolerant," citing levels achieved and any space radiation qualification testing performed as part of the established production process. In addition, any parts that have flight history in established military or commercial space assets should be highlighted, citing the specific program or system (if and where allowed) and number of years/systems deployed (on orbit). The formal response should indicate whether expected hardness levels are based on a radiation hardened manufacturing process, rad-hard by design (RHBD), or some combination of both. Discussion of the "technical approach" should describe the technology manufacturing process, relevant to achieved or expected, radiation hardness levels. Specific design features, including heterogeneous packaging, circuit topologies, digital design fabric and embedded software/firmware attributes relevant to radiation hardness or effects mitigation should be highlighted. All interested parties may submit company and product literature, a white paper no longer than 10 pages, and/or other pertinent information, such as a description with performance parameters and a statement of current availability, summary of prior testing, test reports, a budgetary estimate of test articles, production units, and production quantity breaks. Responses to the Market Survey shall include the following: Submitter's Name Street Address, City, State, Zip Code Business Size Point of Contact (POC) POC Telephone Announcement Number: N00164-19-S-NC23 Contractors must be properly registered in the Government System for Award Management database (SAM). Contractors may obtain information on SAM registration and annual confirmation of requirements by calling +1 (555) 000-0000, or via the internet at www.sam.gov. At the current time, NO FUNDING IS AVAILABLE for contractual efforts. This RFI/sources sought does not constitute an Invitation for Bids (IFB), a Request for Quote (RFQ), or a Request for Proposal (RFP) and it should not be construed as a commitment of any kind by the government to issue a formal solicitation or ultimately award a contract. The US Government is in no way liable to pay for or reimburse any companies or entities that respond to this announcement. Any costs incurred by interested companies in response to this announcement will NOT be reimbursed. Market Survey information may be submitted to the Point of Contact (POC) any time prior to the expiration of this announcement. The POC for this effort is contact@example.gov or +1 (555) 000-0000. The mailing address is: NAVSURFWARCENDIV Crane Attention: Matthew Gadlage, Code GXMR, Bldg 3334 300 Highway 361, Crane, IN 47522-5001. Responses to this RFI/sources sought may be emailed to the POC above. If any part of the submittal is classified, please contact the POC for appropriate submission information. All information marked as proprietary information will be safeguarded to prevent disclosures to non-government personnel and entities.