RESISTOR, CHIP, FIXED, FI
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This solicitation, issued by the DLA Weapons Support Active Devices Division under solicitation number SPE7M5-27-T-1646, is a small business set-aside for the procurement of one fixed film chip resistor, identified by NSN 5905014826118 and part number M55342M06B270JP. The requirement adheres to technical specifications MIL-PRF-55342/6H and MIL-PRF-55342J(2) SUP 1. Delivery is required within 10 days of award, with shipping terms set as FOB Origin and the place of performance located at Fort Bragg, North Carolina. Inspection and acceptance will occur at the destination. The contractor must comply with rigorous packaging and marking standards, including MIL-STD-2073-1E for packaging and MIL-STD-129 for marking. Specific requirements include the use of IPC/JEDEC J-STD-609 for lead finish identification and the application of sensitive electronic device warnings on all exterior containers. Administrative requirements include electronic invoicing through the Wide Area WorkFlow system and adherence to the Buy American Act and various FAR and DFARS clauses regarding cybersecurity, hazardous materials, and labor standards. Evaluation will include a price preference for HUBZone concerns.
General Info
Place of Performance
BLDG A2530 2510 TAYLOR STREET BAY 2, FORT BRAGG, NC, 28310-0000, USASet-Aside
Timeline
Response Deadline
Organization & Contact Information
Full Description
RESISTOR,FIXED,FILM
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
FULL AND OPEN COMPETITION APPLIES.
TDP Rev A Gen 1 IAW BASIC SPEC NR MIL-PRF-55342/6H REVISION NR H DTD 12/30/2024 PART PIECE NUMBER: M55342M06B270JP
TDP Rev A Gen 1 IAW REFERENCE SPEC NR MIL-PRF-55342J(2) SUP 1 REVISION NR J DTD 12/30/2024 PART PIECE NUMBER: M55342M06B270JP
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018894594 0001 EA 1.000
NSN/MATERIAL:5905014826118
DELIVERY (IN DAYS):0010
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
SPE7M5-27-T-1646
SECTION B
PR: 7018894594 PRLI: 0001 CONT’D
INSPECTION POINT: DESTINATION
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:ZZ CLNG/DRY:1 PRESV MAT:ZZ
WRAP MAT:ZZ CUSH/DUNN MAT:ZZ CUSH/DUNN THKNESS:C
UNIT CONT:ZZ OPI:M
INTRMDTE CONT:ZZ INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
This item shall be preserved, packaged, packed, and marked in accordance with (IAW) the specified packaging requirements and per the following NSN/Part Number: 5905-01-482-6118 Quantity: 1 EA Purchase Request: 7018894594QTY: 1 Delivery: 10 days ADO
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