RESISTOR, FIXED, FILM
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
General Info
Place of Performance
1 OVERCASH AVENUE BLDG 9950, CHAMBERSBURG, PA, 17201-4150, USASet-Aside
Documents
1AI Contract Breakdown
Uniform Contract FormatContract not broken down yet
CLEATUS splits the solicitation into Uniform Contract Format (UCF) sections: scope, pricing, deliverables, and evaluation criteria.
Timeline
Response Deadline
Organization & Contact Information
Full Description
RESISTOR, FIXED, FILM
RQ009: INSPECTION AND ACCEPTANCE AT ORIGIN
RQ042: Non-Tailored Higher-Level Quality Requirements (ISO 9001:2015) for Manufacturers and Non-Manufacturers
RQ002: CONFIGURATION CHANGE MANAGEMENT ENGINEERING CHANGE PROPOSAL
REQUEST FOR VARIANCE (DEVIATION OR WAIVER)
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RD002, COVERED DEFENSE INFORMATION APPLIES
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ017: PHYSICAL IDENTIFICATION/BARE ITEM MARKING
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment
RD004: Cybersecurity Maturity Model Certification (CMMC) Level 2 Self-Assessment
CRITICAL APPLICATION ITEM
TDP Rev A Gen 2 IAW BASIC DRAWING NR 18876 10271356 REVISION NR G DTD 11/02/2009 PART PIECE NUMBER: 10271356-124
TDP Rev A Gen 2 IAW REFERENCE DRAWING NR 18876 10271356-124 REVISION NR DTD 04/22/2026 PART PIECE NUMBER:
SPE7M0-27-T-0307
SECTION B
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7018707971 0001 EA 1.000
NSN/MATERIAL:5905015540816
DELIVERY (IN DAYS):0005
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: ORIGIN
ACCEPTANCE POINT: ORIGIN
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:41 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NA CUSH/DUNN THKNESS:C
UNIT CONT:D3 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in
SPE7M0-27-T-0307
SECTION B
PR: 7018707971 PRLI: 0001 CONT’D
accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
BULK BREAK POINT:
W25G1Q
W0L6 USA DEP LETTERKENY
LETTERKENNY ARMY DEPOT
1 OVERCASH AVENUE BLDG 9950
CHAMBERSBURG PA 17201-4150
US
SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
W25G1Q
W0L6 USA DEP LETTERKENY
LETTERKENNY ARMY DEPOT
1 OVERCASH AVENUE BLDG 9950
CHAMBERSBURG PA 17201-4150
US
MARKFOR
W25G1Q
W0L6 USA DEP LETTERKENY
LETTERKENNY ARMY DEPOT
1 OVERCASH AVENUE BLDG 9950
CHAMBERSBURG PA 17201-4150
US
M/F: (TCN) W25G1Q628100TG
RDD:
PROJ: TP 1
SUPP ADD: W25G1Q SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 03
DIC: A0A DIST: ADV: FC: VF
Need Ship Date:00/00/0000 Original Required Delivery Date:10/14/2026
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
SPE7M0-27-T-0307
SECTION B
PR: 7018693400 PRLI: 0001 CONT’D
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0002 7018693400 0001 EA 1.000
NSN/MATERIAL:5905015540816
DELIVERY (IN DAYS):0005
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: ORIGIN
ACCEPTANCE POINT: ORIGIN
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:001 PRES MTHD:41 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:NA CUSH/DUNN THKNESS:C
UNIT CONT:D3 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
PKGING DATA MIL-STD-2073-1E QUP:001 PRES MTHD:41 CLNG/DRY:1 PRESV MAT:00 WRAP MAT:00 CUSH/DUNN MAT:NA CUSH/DUNN THKNESS:C
SPE7M0-27-T-0307
SECTION B
PR: 7018693400 PRLI: 0001 CONT’D
UNIT CONT:D3 OPI:M
INTRMDTE CONT:E5 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:ZZ -ZZ Special Requirements
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
BULK BREAK POINT:
W25G1Q
W0L6 USA DEP LETTERKENY
LETTERKENNY ARMY DEPOT
1 OVERCASH AVENUE BLDG 9950
CHAMBERSBURG PA 17201-4150
US
SHIP BY FASTEST TRACEABLE MEANS. DO NOT USE PARCEL POST.
FREIGHT SHIPPING ADDRESS:
W25G1Q
W0L6 USA DEP LETTERKENY
LETTERKENNY ARMY DEPOT
1 OVERCASH AVENUE BLDG 9950
CHAMBERSBURG PA 17201-4150
US
SPE7M0-27-T-0307
SECTION B
PR: 7018693400 PRLI: 0001 CONT’D
MARKFOR
W25G1Q
W0L6 USA DEP LETTERKENY
LETTERKENNY ARMY DEPOT
1 OVERCASH AVENUE BLDG 9950
CHAMBERSBURG PA 17201-4150
US
M/F: (TCN) W25G1Q627800IU
RDD:
PROJ: TP 1
SUPP ADD: W25G1Q SIG: A
FOR GOVERNMENT USE ONLY: (IPD) 03
DIC: A0A DIST: ADV: FC: VF
Need Ship Date:00/00/0000 Original Required Delivery Date:10/08/2026
PRODUCTION LOT TESTING GOVERNMENT TESTING REQUIRED (REFER TO
PROCUREMENT NOTE E04 FOR ADDITIONAL INFORMATION)
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0003 0000000000 EA 1.000
NSN/MATERIAL:S00000061
DELIVERY (IN DAYS):0005
THIS LINE ITEM SIGNIFIES THE PRODUCTION LOT TEST REQUIREMENT (PLT).
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: ORIGIN
ACCEPTANCE POINT: ORIGIN
Need Ship Date:00/00/0000 Original Required Delivery Date:00/00/0000
SPE7M0-27-T-0307 NSN/Part Number: 5905-01-554-0816 Quantity: 1 EA Purchase Request: 7018707971QTY: 1 Delivery: 5 days ADO
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