This Solicitation opportunity from Department Of Defense was posted on June 22, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
RESISTOR, FIXED, FILM
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
Active Opportunities Like This One
General Info
Agency
NAICS
Place of Performance
3581 CUMMINGS ROAD BLDG 3581, SAN DIEGO, CA, 92136-3581, USASet-Aside
Documents
(1)AI Contract Breakdown
Uniform Contract FormatWhat is UCF?
Uniform Contract Format (UCF) uses AI to break down any contract into standardized sections—scope, pricing, deliverables, and evaluation criteria.
Timeline
Submission Closed
Organization & Contact Information
Full Description
RESISTOR,FIXED,FILM
RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS
(IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE
DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB
AT:
http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx http://www.dla.mil/HQ/Acquisition/Offers/eProcurement.aspx
FOR SIMPLIFIED ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE SOLICITATION ISSUE DATE OR THE AWARD DATE CONTROLS. FOR LARGE ACQUISITIONS, THE REVISION OF THE MASTER IN EFFECT ON THE RFP ISSUE DATE APPLIES UNLESS A SOLICITATION AMENDMENT INCORPORATES A FOLLOW-ON REVISION, IN WHICH CASE THE AMENDMENT DATE CONTROLS.
RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
RQ011: REMOVAL OF GOVERNMENT IDENTIFICATION FROM NON-ACCEPTED SUPPLIES
RQ016: COMPONENT QUALIFIED PRODUCTS LISTS (QPL)/QUALIFIED MANUFACTURERS
LISTS (QML). THIS ITEM CONTAINS ONE OR MORE COMPONENTS DEFINED BY A
SPECIFICATION(S) WITH AN ASSOCIATED QUALIFIED PRODUCTS LIST (QPL) OR
QUALIFIED MANUFACTURERS LIST (QML). QUALIFICATION REQUIREMENTS IN
PROCUREMENT NOTE H02 "COMPONENT QUALIFIED PRODUCTS LIST (QPL)/QUALIFIED
MANUFACTURERS LIST (QML)" APPLY.
IAW BASIC SPEC NR MIL-PRF-39017/3H(5) NOT 1
REVISION NR H DTD 12/04/2024
PART PIECE NUMBER: RLR32C1800GR
IAW REFERENCE SPEC NR MIL-PRF-39017G
REVISION NR G DTD 10/02/2006
PART PIECE NUMBER: RLR32C1800GR
DLA issues this document using the DoD authorized unit of issue, please refer to the following URL to determine the corresponding ANSI X12 unit of issue.
https://view.officeapps.live.com/op/view.aspx?src=https%3A%2F%2Fwww.dla.mil%2FPortals%2F104%2FDocuments% 2FDLMS%2FeApplications%2FLogDataAdmin%2FUnitofIssueandPurchaseUnit.xlsx&wdOrigin=BROWSELINK
CLIN PR PRLI UI QUANTITY UNIT PRICE TOTAL PRICE.
0001 7017236414 0001 EA 57.000
NSN/MATERIAL:5905011137776
DELIVERY (IN DAYS):0165
DELIVER FOB: ORIGIN
QTY VARIANCE: PLUS 0% MINUS 0%
INSPECTION POINT: DESTINATION
SPE7M5-26-T-267P
SECTION B
PR: 7017236414 PRLI: 0001 CONT’D
ACCEPTANCE POINT: DESTINATION
PREP FOR DELIVERY:
PKGING DATA MIL-STD-2073-1E
QUP:005 PRES MTHD:41 CLNG/DRY:1 PRESV MAT:00
WRAP MAT:00 CUSH/DUNN MAT:00 CUSH/DUNN THKNESS:0
UNIT CONT:D3 OPI:M
INTRMDTE CONT:D3 INTRMDTE CONT QTY:AAA
PACK CODE:U
MARKING SHALL BE IN ACCORDANCE WITH MIL-STD-129.
SPECIAL MARKING CODE:00 -00 No special marking
PALLETIZATION SHALL BE IN ACCORDANCE WITH RP001: DLA PACKAGING REQUIREMENTS FOR PROCUREMENT
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
UNIT PACKAGE MARKING REQUIREMENT FOR COMPONENT LEAD FINISH
(a) In addition to all other marking requirements in this contract, the Contractor shall apply one of the assigned markings in accordance with paragraphs 5.3.1 and 5.3.2 of IPC/JEDEC J-STD-609, Marking and Labeling of Components, printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) to Identify Lead (Pb), Pb-Free and Other Attributes, to each individual unit pack of the item being acquired. Placement of the markings shall be in accordance with paragraph 6.2 of the standard.
(b) Copies of the current version of this standard may be purchased or downloaded from the Association Connecting Electronics Industry (IPC), http://www.ipc.org, http://www.ipc.org, or the Solid State Technology Association (JEDEC), http://www.jedec.org. http://www.jedec.org.
PARCEL POST ADDRESS:
SW3218
DLA DISTRIBUTION SAN DIEGO
3581 CUMMINGS ROAD BLDG 3581
SAN DIEGO CA 92136-3581
US
FOR TRANSPORTATION SEE DLAD DLAD PROC NOTE C19. FOR FIRST DESTINATION TRANSPORTATION SEE DLAD PROC NOTE
C20 AND CONTRACT
FREIGHT SHIPPING ADDRESS:
SPE7M5-26-T-267P
SECTION B
PR: 7017236414 PRLI: 0001 CONT’D
SW3218
DLA DISTRIBUTION SAN DIEGO
3581 CUMMINGS ROAD BLDG 3581
SAN DIEGO CA 92136-3581
US
Need Ship Date:12/15/2026 Original Required Delivery Date:04/17/2027
SPE7M5-26-T-267P NSN/Part Number: 5905-01-113-7776 Quantity: 57 EA Purchase Request: 7017236414QTY: 57 Delivery: 165 days ADO
More opportunities from Department Of Defense → ACTIVE DEVICES DIVISION
Same awarding agency
Find Active Opportunities Like This
Get AI-powered intelligence on the opportunities still open
Every page of the solicitation package shredded into a compliance breakdown
AI-powered matching based on your capabilities and past performance
Competitor and incumbent history on the requirement
Automated alerts on amendments, Q&A deadlines, and award
Join 650+ contractors already using CLEATUS
