RFI for MICROELECTRONICS RESEARCH, DEVELOPMENT, AND PRODUCTION CAPABILITY
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The Department of Energy, through its National Nuclear Security Administration, is issuing a Request for Information to assess the current market capabilities of vendors capable of supporting the Office of Warhead Assembly and Non-Nuclear Modernization in the research, development, and production of advanced microelectronics. This includes CMOS-based digital, analog, and mixed-signal circuits, micro-electromechanical systems, silicon photonics, and quantum devices such as micro-fabricated ion traps. The intent is to evaluate existing industry capacity to ensure the long-term reliability and modernization of nuclear weapons components, with no set-aside provisions indicating open competition. Respondents must submit detailed capability statements to the designated point of contact, Brenda Hamilton, with a copy to Ashley Patterson, by the deadline of August 13, 2026. The solicitation number is NAPAS315MC2, and while the official posting is linked online, physical performance will occur at Road Forks, New Mexico, 87117, with the contracting office located in Richland, Washington.
General Info
Agency
NAICS
Place of Performance
ROAD FORKS, NM, 87117, USASet-Aside
Timeline
Response Deadline
Organization & Contact Information
Full Description
Request For Information (RFI) only for interested vendors that can provide capaibility statement to fulfill the requirement in support of the Office of Warhead Assembly and Non-Nuclear Modernization (NA-193), to determine the existing market capability of businesses to produce or contribute to the production of microelectronics.
NA-193 oversees the modernization of production facilities that manufacture the materials and components necessary for the long-term reliability of the Nation’s nuclear weapons, including microelectronics. These microelectronic products include a variety of complementary metal-oxide semiconductor (CMOS) based products (including digital, analog, and mixed signal), micro-electromechanical systems (MEMS), silicon photonics, and quantum devices (e.g., micro-fabricated ion traps).
Attachment A Technical Requirements are attached for further details.
Please provide your capability statements to the Primary POC; Brenda Hamilton, brenda.hamilton1@nnsa.doe.gov and cc Ashley Patterson, ashley.patterson@nnsa.doe.gov