Semiconductor Die Bonding and Vacuum Packaging System
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The Naval Research Laboratory, an office within the Department of Defense, has awarded a contract to Cook and Weil, Inc. for a Semiconductor Die Bonding and Vacuum Packaging System. This award was processed under simplified procedures for commercial items as outlined in FAR subpart 13.5, with the project falling under NAICS code 333993. The contract, identified by solicitation number N0017326P2436, is managed by primary point of contact Kevin Nguyen. Performance of the contract is designated to take place in Washington, District of Columbia.
General Info
Contract Value
$672,985Place of Performance
Washington, DC, 20375, USASet-Aside
Awardee
COOK AND WEIL, INC.Award Issued Date
Documents
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Timeline
Organization & Contact Information
Full Description
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
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