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This Solicitation opportunity from Department Of Commerce was posted on May 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Silicon and Silicon/Germanium Epitaxial Wafers

Closed
1333ND26QNB030152Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334413
New
DIBBS
TRANSISTOR
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POSTED

1 day ago

DEADLINE

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NAICS: 334413
New
DIBBS
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Solicitation # SPE7M8-26-T-6376
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ELECTRICAL DEVICES DIV

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1 day ago

DEADLINE

in 4 days
NAICS: 334413
New
DIBBS
MICROCIRCUIT, LINEAR
Solicitation # SPE7M5-26-T-453R
Solicitation SPE7M5-26-T-453R is a small business set-aside request for quotations issued by the DLA Land and Maritime Active Devices Division for the procurement of two linear microcircuits, identified as critical application items. The required hardware is part number SBF-5089Z, manufactured by Qorvo US, Inc., under NSN 5962016152779. Delivery is required within 157 days after order, with a need ship date of February 16, 2027, and a final required delivery date of April 8, 2027. The items are to be delivered FOB Origin to DLA Distribution DDWO in Columbus, Ohio, with inspection and acceptance occurring at the destination. The contract mandates strict quality and compliance standards, including CMMC Level 2 self-assessment and adherence to the Qualified Suppliers List of Distributors and Qualified Testing Suppliers List for FSC 5961 and 5962. Contractors must provide traceability documentation or test reports via DLA Land and Maritime Form 918 and receive written authorization from the contract administrator before shipping. Packaging must comply with MIL-STD-2073-1E and MIL-STD-129, featuring specific ESD and EMI protections per MIL-PRF-81705 and specialized cushioning per A-A-59136. Additionally, unit packages must be marked according to IPC/JEDEC J-STD-609 for lead finish identification. Payment will be processed electronically through the Wide Area WorkFlow system.
ACTIVE DEVICES DIVISION

POSTED

1 day ago

DEADLINE

in 4 days

AI Contract Overview

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This solicitation seeks the procurement of silicon and silicon/germanium epitaxial wafers from small businesses under a total small business set-aside, with NAICS code 334413 and solicitation number 1333ND26QNB030152, issued by NIST under the U.S. Department of Commerce. The wafers must be fabricated to precise specifications, including 100 mm diameter substrates and specific layer structures such as alternating 10 nm Si and Si0.70Ge0.30 films with boron doping, with a composition tolerance of ±0.05 atomic percent for SiGe layers. The government does not mandate a specific growth method, allowing vendors to use either CVD or MBE based on the film stack requirements, as long as all technical criteria are met. Deliverables include 15 wafers per base line item, with optional line items for additional specifications, all due 20 weeks after contract award, and the contract operates under F.O.B. Destination terms requiring delivery to NIST’s facility in Gaithersburg, Maryland during business hours after prior coordination. The evaluation process follows a lowest price, technically acceptable (LPTA) model where quotes must first meet all technical requirements—verified through XRR, HR-XRD, SIMS, and SRP testing—as a pass/fail threshold before price becomes the determining factor. Contract administration requires electronic invoicing via NIST’s designated platforms, either INVOICE@NIST.GOV or the Treasury’s IPP system, and compliance with numerous FAR clauses including those on whistleblower rights, anti-trafficking, Buy American, and subcontracting restrictions, all of which include deviations effective January 2026. Offerors must maintain an active UEI in SAM.gov and represent size status post-award, while the contractor is obligated to indemnify the government against intellectual property claims and allow record access by the Comptroller General for audit purposes. There are no prescribed packaging, preservation, marking, or barcoding standards beyond alignment with carrier requirements, and the contract explicitly excludes military specifications, operating instead under FAR Part 12 for commercial items.

General Info

Solicitation for 100mm silicon/silicon-germanium wafers, small business set-aside, deadline May 12, 2026.

Agency

Department Of Commerce NistView Agency

NAICS

334413 - Semiconductor and Related Device ManufacturingView NAICS

Place of Performance

MD

Set-Aside

SBA

Documents

(2)

RFQ 1333ND26QNB030152 - Procurement of Silicon and Silicon/Germanium Epitaxial Wafers

PDFrfq

NIST Epitaxial Film Wafers Q&A Clarifications

PDFq-and-a

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Timeline

2 updates
PhaseClosed
Posted

Solicitation

Amendment 1

Contract was updated

Amendment 2

Contract was updated

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Commerce Nist
Contacts1 person available
OfficeGAITHERSBURG, MD, 20899, USA
Organization / Agency
Department Of Commerce Nist
View Agency Profile
Office AddressGAITHERSBURG, MD, 20899, USA
Contacts
Erik Frycklund

Full Description

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This solicitation is being amended again to answer public questions raised.  The questions and the NIST response have been addressed as an updated attachment.   


No additonal changes have been made.




This solicitation is being amended to answer public questions raised and to update a minimum specification.


Question 1: For line items 1-7, could you please confirm the substrate diameter?


Answer 1: The substrate diameter is 100 mm.


Question 2: What is the preferred method of growth (1) CVD (Chemical Vapor Deposition) or (2) MBE (Molecular Beam Epitaxy).


Answer 2: (B)  The government is not specifying the production method and any production method that yields wafers meeting all specifications including thickness, composition, and coherency would be acceptable.  Vendors may elect to use different growth methods for different film stacks (e.g. MBE for thin stacks, and CVD for thick films).


Minimum specification addition: For SiGe films, the composition tolerance is 5 atomic percent.  For example Si0.70Ge0.30 means Si0.70±0.05Ge0.30±0.05, and a film with a composition of Si0.67Ge0.33 would be within specification for a nominal Si0.70Ge0.30 requirement.


No additional changes have been made.




Please see attached document.

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NAICS: 513210
New
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The National Institute of Standards and Technology (NIST) is seeking firm-fixed-price quotations for the SRD License Key System under solicitation 1333ND26QNB640575. This acquisition is a 100 percent small business set-aside under NAICS code 513210. The objective is to implement a software licensing solution that secures Standard Reference Data across three distribution tiers, enforces single-usage licenses, and protects intellectual property while maintaining geographic restrictions. The system must integrate with Salesforce via API, support license generation for various formats including Windows and Apple executables, zip files, websites, and databases, and utilize NIST SP 800-52 encryption standards. It also requires Active Directory/SSO with PIV authentication and an API mechanism for tracking third-party distributor sales. The contract structure consists of a 12-month base period and four optional 12-month extension years through FY30. Award will be based on best value, evaluating technical acceptability, past performance, and price. The quotation submittal deadline has been extended to 10:00 AM EST on September 15, 2026. Deliverables, including access credentials, API documentation, and administrative manuals, must be provided electronically to the Contracting Officer Representative. Performance will be remote, though the place of acceptance is Gaithersburg, Maryland. Payments are to be processed electronically through the Invoice Processing Platform System (IPP) and emailed to the NIST invoice address.
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