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NAICS Code· 334413

NAICS 334413: Semiconductor and Related Device Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing semiconductors and related solid-state devices. Examples of products made by these establishments are integrated circuits, memory chips, microprocessors, diodes, transistors, solar cells, and other optoelectronic devices. Show more

NAICS 334413 – Semiconductor and Related Device Manufacturing encompasses the design, fabrication, and assembly of semiconductor devices including integrated circuits, diodes, transistors, sensors, and microelectronic components used in defense, aerospace, communications, and critical infrastructure systems. This sector supports the production of specialized chips for radar systems, electronic warfare platforms, secure communications, guidance systems, and embedded computing hardware essential to national security applications.

179
Active Contracts
$109.4M
Total Obligations (12mo)
1.9K
Awarded Contracts (12mo)
427
Contractors Awarded (12mo)
3
Median Bidders per Award
-38.6%
YoY Growth

Industry Spending Overview

Federal obligations, top contractors and agencies, and related industry codes for NAICS 334413.

AI Industry Description

NAICS 334413 – Semiconductor and Related Device Manufacturing encompasses the design, fabrication, and assembly of semiconductor devices including integrated circuits, diodes, transistors, sensors, and microelectronic components used in defense, aerospace, communications, and critical infrastructure...

NAICS 334413 – Semiconductor and Related Device Manufacturing encompasses the design, fabrication, and assembly of semiconductor devices including integrated circuits, diodes, transistors, sensors, and microelectronic components used in defense, aerospace, communications, and critical infrastructure systems. This sector supports the production of specialized chips for radar systems, electronic warfare platforms, secure communications, guidance systems, and embedded computing hardware essential to national security applications. Manufacturing processes involve photolithography, wafer fabrication, thin-film deposition, and packaging technologies compliant with MIL-STD and DoD supply chain integrity requirements. The industry is foundational to modern defense electronics, bridging advanced materials science with precision manufacturing to meet stringent performance, reliability, and radiation-hardening standards. Top contractors in this sector include large defense primes and specialized semiconductor foundries with deep expertise in military-grade chip design and trusted fabrication. Many are classified as Tier 1 suppliers with AS9100 and ITAR certifications, often partnering with government labs and national laboratories to develop next-generation silicon and compound semiconductor solutions. A competitive landscape exists between established players with legacy fabrication facilities and emerging firms leveraging advanced packaging and heterogeneous integration techniques. The Department of Defense is the primary federal buyer, driving demand through programs in hypersonics, electronic warfare, satellite communications, and secure microelectronics for tactical systems. Demand is fueled by initiatives to domesticize semiconductor supply chains and reduce reliance on foreign foundries, particularly for radiation-tolerant and quantum-resistant components. The market is highly technical and capital-intensive, with opportunities concentrated in R&D, prototyping, and qualified manufacturing for classified and controlled environments. Contractors with DoD-accredited fabrication facilities, secure supply chain controls, and experience in radiation-hardened design are best positioned to compete. Increasing emphasis on secure foundry access and trusted sourcing continues to reshape procurement priorities.

Top Contractors

Companies with the highest total award value under NAICS 334413, ranked by dollars won.

Competition

How many companies historically bid on federal awards in NAICS 334413, from bidder counts reported on USAspending.

Moderate Competition

Median 3-5 bidders per reported award. · 65,714 reported awards

Median Bidders

3

Per reported award, all-time

Single-Bid Awards

28%

Share of reported awards with one bidder

10+ Bidder Awards

8%

Share of reported awards with 10+ bidders

Reported Awards

0

97% of 67,659 total awards

How this code compares up the NAICS hierarchy. Parent cohorts pool every code under their prefix, so they are the steadier baseline when a 6-digit sample is thin.

Industry FamilyCompetitionMedian BiddersSingle-BidBidder MixReported Awards
334413This Code
Semiconductor and Related Device Manufacturing
Moderate Competition328%
65,71497% of 67,659
33441NAICS Industry
Fewer Bidders233%
682,20093% of 733,606
3344Industry Group
Semiconductor and Other Electronic Component Manufacturing
Fewer Bidders233%
682,20093% of 733,606
334Subsector
Fewer Bidders250%
2,652,52488% of 3,011,428
33Sector
Manufacturing
Fewer Bidders244%
16,852,66969% of 24,321,569

Bidder counts reported on past federal awards in this NAICS (USAspending). An open opportunity has no bidders yet, so this is the historical norm for similar work, not a fact about this solicitation. Not all awards report bidder counts, and fewer bidders often means incumbent-held work rather than an easier win. Federal reporting of bidder counts fell from ~96% of awards (FY2016) to ~30% (FY2018 onward); the chart shows shares of reported awards, and washed-out stretches mark years with fewer than 30 of them.

Related NAICS Codes

Industries similar to Semiconductor and Related Device Manufacturing, by shared sector, subsector, and industry group.

Bare Printed Circuit Board Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing bare (i.e., rigid or ...
334412Same Industry GroupHigh Similarity

Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing

This U.S. industry comprises establishments primarily engaged in one or more of the following: (1) m...
334416Same Industry GroupHigh Similarity

Electronic Connector Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing electronic connectors...
334417Same Industry GroupHigh Similarity

Printed Circuit Assembly (Electronic Assembly) Manufacturing

This U.S. industry comprises establishments primarily engaged in loading components onto printed cir...
334418Same Industry GroupHigh Similarity

Other Electronic Component Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing electronic components...
334419Same Industry GroupHigh Similarity

Electronic Computer Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing and/or assembling ele...
334111Same SubsectorMedium Similarity

Computer Storage Device Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing computer storage devi...
334112Same SubsectorMedium Similarity

Computer Terminal and Other Computer Peripheral Equipment Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing computer terminals an...
334118Same SubsectorMedium Similarity

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NAICS 334413 FAQ

Frequently Asked Questions

NAICS code 334413 covers Semiconductor and Related Device Manufacturing. This U.S. industry comprises establishments primarily engaged in manufacturing semiconductors and related solid-state devices. Examples of products made by these establishments are integrated circuits, memory chips, microprocessors, diodes, transistors, solar cells, and other optoelectronic devices.

Recently Posted in Semiconductor and Related Device Manufacturing

NAICS: 334413
New
DIBBS
SEMICONDUCTOR DEVIC
Solicitation # SPE7M5-26-T-354D
The Defense Logistics Agency is soliciting 56 units of a semiconductor device identified by NSN 5961-01-609-7220 under solicitation SPE7M5-26-T-354D, with a response deadline of August 6, 2026. The procurement is categorized under NAICS code 334413 and involves delivery to the designated destination at W62G2T, W1A8 DLA DIST SAN JOAQUIN, Tracy, CA 95304-5000, with a required delivery timeline of 11 days after award and a need ship date of August 18, 2026. Delivery must conform to FOB Destination terms, and the item must comply with MIL-DTL-19491 for preservation and packaging, MIL-STD-2073-1E for packaging, MIL-STD-129 for marking and barcoding, and IPC/JEDEC J-STD-609 for Pb/Pb-free lead finish identification. Packaging must follow RP001: DLA PACKAGING requirements, and preservation is designated as “ZZ” indicating a clean/dry process with no preservation material specified. Hazardous material handling and labeling must adhere to 29 CFR 1910.1200, and mercury-containing components are prohibited unless exempted and properly contained per NAVSEA 5100-003D. All items require traceability documentation per DLAD Procurement Note #C03 and must be submitted via WAWF for invoicing with the appropriate document type based on contract line item. The contract incorporates multiple Federal Acquisition Regulation clauses, including Alternate I of 52.216-1 for contract type, Alternate I of 52.222-36 for equal opportunity, and Alternate I and II of 52.227-1 for authorization and consent, all modified under Deviation 2026-00038 effective February 2026. Additional clauses cover cybersecurity under 252.204-7012 and 52.240-93, trafficking in persons, employment eligibility verification, sustainable products, hazardous material safety, and restrictions on covered defense telecommunications equipment. Offerors must represent their size status and socioeconomic certifications via SAM, including identification as a small
ACTIVE DEVICES DIVISION

POSTED

1 day ago

DEADLINE

in 4 days
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NAICS: 334413
New
DIBBS
CONNECTOR, RECEPTACLE, E
Solicitation # SPE7M1-26-U-5232
This solicitation, issued by DLA Land and Maritime under solicitation number SPE7M1-26-U-5232, is a Request for Quotations for an Indefinite Delivery Contract (IDC) to procure electrical receptacle connectors (NSN 5935-00-254-9192). The contract is a Total Small Business Set-Aside with a maximum ceiling value of $350,000. While the contract includes an estimated annual quantity of 76 units, it is not a firm quantity contract; however, it does include a guaranteed minimum of 11 units. Delivery is required within 128 days after a request is made, with terms set as FOB Origin and inspection and acceptance occurring at the destination. The contract imposes stringent technical and environmental compliance requirements. Contractors must adhere to specific packaging and preservation standards, including MIL-STD-2073-1E, MIL-STD-129 for marking, and MIL-DTL-55330 for connector preservation. There are strict prohibitions against the use of mercury or mercury compounds in all aspects of packaging and marking, as well as a prohibition on Class I ozone-depleting substances and hexavalent chromium. Additionally, the contract incorporates significant regulatory clauses regarding cybersecurity, the safeguarding of covered defense information, and the prohibition of certain foreign telecommunications equipment. Proposals must be submitted via the DIBBS platform by the deadline of August 27, 2026.
MARITIME SUPPLY CHAIN

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NAICS: 334413
Awarded
DIBBS
MICROCIRCUIT, DIGITA
Solicitation # SPE7M5-26-T-330X
This contract pertains to the procurement of 30 units of a digital microcircuit, specifically the Texas Instruments CD4053BE, under Federal Supply Class 5962 for electronic microcircuits. The item must comply with stringent technical, quality, and cybersecurity standards, including adherence to the DLA Master List of Technical and Quality Requirements referenced by R and I numbers, as well as a self-assessment for Cybersecurity Maturity Model Certification (CMMC) Level 2. The part must originate from an approved source, with full traceability maintained throughout the supply chain, and all documentation retained in accordance with DLA Procurement Note C03. Traceability and test reports are mandatory and must be submitted electronically to DLA’s CDAP monitoring email no later than 15 days before delivery, with each submission not exceeding 15 megabytes and following a strict naming convention. Shipment cannot proceed until written authorization is received from the contract administrator. Each shipment must include a completed DLA Land and Maritime Form 918 and authorization confirmation within the packaging. Any discrepancies or unauthorized shipments will result in non-final payment. All components must be packed in compliance with MIL-STD-2073-1E and MIL-STD-129 for marking, with lead finish identification conforming to IPC/JEDEC J-STD-609. ESD and EMI protections are required, using qualified barrier materials per MIL-PRF-81705 Type I and Type III, sourced from manufacturers listed on QPL-81705. Cushioning must meet A-A-59136 Class 1 Grade B density specifications or use form-fitting ESD-protective containers that immobilize leads. Packaging must prevent damage during transit, with additional requirements for preservation, containment, and labeling. Delivery is FOB origin, with a 148-day lead time, and inspection and acceptance occur at destination. The contract mandates strict adherence to DLA packaging and marking directives, including special requirements for the Federal Supply Class, and prohibits the shipment of unmarked or non-compliant items. The supply chain must be fully traceable, with all documentation retained by the contractor, and physical identification of items must align with mandated marking standards. Delivery is directed to DLA Distribution in Columbus, Ohio, with a required ship date of December 23, 2026, and original delivery deadline of November 29, 2026.
Defense Logistics Agency

POSTED

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DEADLINE

N/A
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NAICS: 334413
New
Federal
MICROCIRCUIT ASSEMB
Solicitation # N0010426QUC33
Solicitation NO0014-26-Q-UC33 is a request for quotations issued by NAVSUP Weapon Systems Support for the teardown, evaluation, repair, and potential modification of microcircuit assemblies, specifically NSN 5962-01-471-6545. The government requires a firm-fixed price, not-to-exceed, or estimated price for the repair, and will not accept quotes limited only to test and evaluation. A key performance requirement is a Repair Turnaround Time of 80 days after receipt of the asset, with a specified induction expiration date of 180 days after the contract award. Failure to meet the required turnaround time will result in a price reduction per unit per month, to be implemented via a reconciliation modification. The awardee must be an authorized repair source and adhere to ISO9001 quality requirements and IUID compliance per DFARS 252.211-7003. Packaging and marking must conform to MIL-STD-2073 and MIL-STD-129, with physical identification following MIL-STD-130. Evaluation for award will prioritize past performance, utilizing the DoD Supplier Performance Risk System to assess item, price, and supplier risk, with price serving as a secondary factor. All electronic submissions, including quotes and certifications, must be directed to the primary point of contact, Rachael L. Costanzo. Payment and invoicing will be processed through the Wide Area Workflow system.
Navsup Weapon Systems Support Mech

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