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NAICS Code· 334412

NAICS 334412: Bare Printed Circuit Board Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing bare (i.e., rigid or flexible) printed circuit boards without mounted electronic components. These establishments print, perforate, plate, screen, etch, or photoprint interconnecting pathways for electric current on laminates. Cross-References. Establishments primarily engaged in--Show more

NAICS 334412 – Bare Printed Circuit Board Manufacturing covers the production of unpopulated printed circuit boards (PCBs), including single-sided, double-sided, and multilayer rigid and flexible substrates fabricated using photolithographic etching, drilling, plating, and lamination processes. These bare boards serve as the foundational electrical interconnect platforms for advanced electronic assemblies used in defense systems, avionics, radar, communications gear, and mission-critical instrumentation.

179
Active Contracts
$1.5B
Total Obligations (12mo)
2.1K
Awarded Contracts (12mo)
635
Contractors Awarded (12mo)
1
Median Bidders per Award
+51.0%
YoY Growth

Industry Spending Overview

Federal obligations, top contractors and agencies, and related industry codes for NAICS 334412.

AI Industry Description

NAICS 334412 – Bare Printed Circuit Board Manufacturing covers the production of unpopulated printed circuit boards (PCBs), including single-sided, double-sided, and multilayer rigid and flexible substrates fabricated using photolithographic etching, drilling, plating, and lamination processes. Thes...

NAICS 334412 – Bare Printed Circuit Board Manufacturing covers the production of unpopulated printed circuit boards (PCBs), including single-sided, double-sided, and multilayer rigid and flexible substrates fabricated using photolithographic etching, drilling, plating, and lamination processes. These bare boards serve as the foundational electrical interconnect platforms for advanced electronic assemblies used in defense systems, avionics, radar, communications gear, and mission-critical instrumentation. In government contracting, this sector supports the supply chain for high-reliability electronics, where stringent MIL-STD and IPC specifications govern material selection, trace integrity, and environmental resilience. Manufacturers in this space must comply with rigorous quality assurance protocols, including AS9100 and IPC-A-600 standards, and often operate under ITAR and EAR regulatory frameworks due to the defense applications of their products. Top contractors in this sector include ADVANCED COMPOSITE PRODUCTS, INC., STARWIN INDUSTRIES, LLC, and EVERSTONE INDUSTRIES LLC, all of which are small businesses specializing in low-to-medium volume, high-complexity PCB fabrication for defense and aerospace applications. These firms typically serve as niche suppliers to prime contractors, offering agile production capabilities and custom engineering support for ruggedized and miniaturized board designs. The Department of Defense is the dominant buyer, with demand driven by modernization programs in electronic warfare, unmanned systems, satellite communications, and next-generation soldier systems. Procurement is concentrated in programs requiring secure, tamper-resistant circuitry and rapid prototyping cycles. The competitive landscape is characterized by a high barrier to entry due to technical expertise, certification requirements, and supply chain security mandates. Opportunities exist for specialized manufacturers with certified fabrication facilities, particularly those capable of producing HDI, flex-rigid, and microwave-frequency boards. Demand is increasingly tied to domestic sourcing initiatives and resilience-focused supply chain reforms.

Top Contractors

Companies with the highest total award value under NAICS 334412, ranked by dollars won.

Top Agencies

Federal agencies directing the most contract spending toward NAICS 334412.

Department Of Defense1,680 awards$1.1B
Department Of Defense (dod)329 awards$211.6M
Ut DLA Aviation At Ogden6 awards$59.3M
Navsup Weapon Systems Support Mech1 award$49.7M
Al DLA Aviation At Huntsville9 awards$30.7M
DLA Land Warren7 awards$19.4M
DLA Land And Maritime89 awards$17.8M
Pa DLA Aviation At Philadelphia2 awards$851K
DLA Aviation5 awards$471K
Navsup Weapon Systems Support1 award$436K

Competition

How many companies historically bid on federal awards in NAICS 334412, from bidder counts reported on USAspending.

Usually Single-Bid

Half or more of reported awards drew exactly one bidder, usually a sign of incumbent-held work rather than an open field. · 61,089 reported awards

Median Bidders

1

Per reported award, all-time

Single-Bid Awards

70%

Share of reported awards with one bidder

10+ Bidder Awards

3%

Share of reported awards with 10+ bidders

Reported Awards

0

95% of 64,002 total awards

How this code compares up the NAICS hierarchy. Parent cohorts pool every code under their prefix, so they are the steadier baseline when a 6-digit sample is thin.

Industry FamilyCompetitionMedian BiddersSingle-BidBidder MixReported Awards
334412This Code
Bare Printed Circuit Board Manufacturing
Usually Single-Bid170%
61,08995% of 64,002
33441NAICS Industry
Fewer Bidders233%
682,20093% of 733,606
3344Industry Group
Semiconductor and Other Electronic Component Manufacturing
Fewer Bidders233%
682,20093% of 733,606
334Subsector
Fewer Bidders250%
2,652,52488% of 3,011,428
33Sector
Manufacturing
Fewer Bidders244%
16,852,66969% of 24,321,569

Bidder counts reported on past federal awards in this NAICS (USAspending). An open opportunity has no bidders yet, so this is the historical norm for similar work, not a fact about this solicitation. Not all awards report bidder counts, and fewer bidders often means incumbent-held work rather than an easier win. Federal reporting of bidder counts fell from ~96% of awards (FY2016) to ~30% (FY2018 onward); the chart shows shares of reported awards, and washed-out stretches mark years with fewer than 30 of them.

Related NAICS Codes

Industries similar to Bare Printed Circuit Board Manufacturing, by shared sector, subsector, and industry group.

Semiconductor and Related Device Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing semiconductors and re...
334413Same Industry GroupHigh Similarity

Capacitor, Resistor, Coil, Transformer, and Other Inductor Manufacturing

This U.S. industry comprises establishments primarily engaged in one or more of the following: (1) m...
334416Same Industry GroupHigh Similarity

Electronic Connector Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing electronic connectors...
334417Same Industry GroupHigh Similarity

Printed Circuit Assembly (Electronic Assembly) Manufacturing

This U.S. industry comprises establishments primarily engaged in loading components onto printed cir...
334418Same Industry GroupHigh Similarity

Other Electronic Component Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing electronic components...
334419Same Industry GroupHigh Similarity

Electronic Computer Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing and/or assembling ele...
334111Same SubsectorMedium Similarity

Computer Storage Device Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing computer storage devi...
334112Same SubsectorMedium Similarity

Computer Terminal and Other Computer Peripheral Equipment Manufacturing

This U.S. industry comprises establishments primarily engaged in manufacturing computer terminals an...
334118Same SubsectorMedium Similarity

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NAICS 334412 FAQ

Frequently Asked Questions

NAICS code 334412 covers Bare Printed Circuit Board Manufacturing. This U.S. industry comprises establishments primarily engaged in manufacturing bare (i.e., rigid or flexible) printed circuit boards without mounted electronic components. These establishments print, perforate, plate, screen, etch, or photoprint interconnecting pathways for electric current on laminates. Cross-References. Establishments primarily engaged in--

Recently Posted in Bare Printed Circuit Board Manufacturing

NAICS: 334412
New
Federal
59--CIRCUIT CARD ASSEMB
Solicitation # SPRMM126RGE84
The Government is seeking to procure 30 units of a circuit card assembly identified by NSN 7G-5998-016306554 under a sole-source procurement authorized by FAR 6.302-1, due to the unavailability of competitive sources. The part is subject to proprietary data restrictions, and the Government has determined it is uneconomical to acquire the underlying data rights or to reverse engineer the component, limiting procurement to the original manufacturer or a single qualified source. Delivery will be FOB origin, and no competitive solicitation is planned, though responsible parties may submit capability statements within 45 days of the notice’s publication, or 30 days if an existing Basic Ordering Agreement applies, for the Government’s consideration in determining whether to proceed with competition. All data and technical documentation related to this item, including Military Specifications, Qualified Products Lists, and Federal Standards, must be obtained through the DODSSP via the ASSIST-Online portal or by direct request to the DLA Document Services office; however, proprietary items such as drawings, patterns, and deviation lists are not accessible through these channels. The acquisition is outside the scope of FAR Part 12 commercial item procedures, and while the Government may consider proposals for commercial alternatives, interested parties must notify the contracting officer within 15 days. The contracting office is part of the Department of Defense’s SPRMM1 DLA Mechanicsburg in Pennsylvania, with primary point of contact Brendan T. Heasley, and the solicitation notice was issued on July 21, 2026, with responses due by September 4, 2026. No contract value, delivery schedule, packaging requirements, evaluation criteria, or formal contract clauses have been established at this pre-solicitation stage, as this notice serves solely as a market survey to gauge industry capability.
SPRMM1 DLA Mechanicsburg

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NAICS: 334412
New
DIBBS
CIRCUIT CARD ASSEMB
Solicitation # SPE7M1-26-U-5100
This contract is a simplified indefinite-delivery contract issued by the Department of Defense through the Defense Logistics Agency under solicitation SPE7M1-26-U-5100 for the procurement of 18 circuit card assemblies identified by NSN 5998-01-633-2958. The estimated annual quantity is 18 units at a unit price of $18.00, with a maximum contract value of $350,000. Delivery is required FOB origin within 160 days of order placement, and the item must be delivered to a designated destination identified in the schedule. The contract includes a guaranteed minimum order quantity of two units and a minimum delivery order quantity of four units. All items are subject to strict packaging and handling requirements per MIL-STD-2073-1E and MIL-STD-129, with special emphasis on electrostatic discharge and electromagnetic interference protection using DOD-qualified materials per MIL-PRF-81705. The supplier must verify that all ESD/EMI barrier materials originate from qualified manufacturers listed on QPL-81705 and must use approved cushioning to prevent damage to component leads and terminals. Shipping containers must comply with MIL-STD-129 marking requirements, including omission of item nomenclature due to the classification of the item as protected cargo. The solicitation incorporates a comprehensive set of FAR and DFARS clauses covering cybersecurity, safeguarding covered defense information, prohibition on certain telecommunications equipment, whistleblower rights, labor standards, hazardous materials, export control, and domestic sourcing obligations under the Buy American Act and Berry Amendment. The contract requires compliance with the Cybersecurity Maturity Model Certification Level 2 self-assessment and NIST SP 800-171 assessment requirements. Payment must be processed electronically through the Wide Area WorkFlow system with submission of invoice and receiving report for fixed-price line items. All submissions must be made via the DLA Internet Bid Board System prior to the closing date of August 24, 2026, and award will be made to the responsible offeror whose quote is most advantageous to the government, considering price and other factors. The contractor must maintain current representations in the System for Award Management and comply with all applicable safety, environmental, and cybersecurity protocols.
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