This Government Contract opportunity from Arizona was posted on May 17, 2025. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Silicon Wafer Dicing Saw Supply and Integration
Contract Overview
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AI Contract Overview
The University of Arizona is seeking a subcontractor for the supply, delivery, installation, and commissioning of a silicon wafer dicing saw. The required equipment must be capable of processing silicon, quartz, sapphire, and glass wafers up to 300mm in size. Key technical specifications include a GUI-controlled system for full wafer dicing and the ability to support odd-shaped substrates. This opportunity was posted on May 17, 2025, with a response deadline of June 5, 2025. The project falls under NAICS code 333242. Interested parties can find further details and submission guidelines through the University of Arizona vendors portal.
General Info
Agency
Place of Performance
AZ, USASet-Aside
Documents
This scope was carved out of S192522.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Requset for Proposals for a Wafer Dicing Saw
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
Earlier notices in this NAICS code
Posted before this notice, open and closed
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