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Single-Chip Sensor and Electronics Integration

Active
SBIR / STTR

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

National Aeronautics and Space Administration → NASA SBIR/STTR ProgramView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Cleveland, IA, 44135, USA

Set-Aside

SBA

Documents

This scope was carved out of S13.05-2543.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Quantum Sensor for D/H Ratio Measurement in Water in Outer Planets

AI Contract Breakdown

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyNational Aeronautics and Space Administration → NASA SBIR/STTR Program
ContactsNo contacts available
OfficeN/A
Organization / Agency
National Aeronautics and Space Administration → NASA SBIR/STTR Program
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Miniaturization of the quantum sensor with supporting electronics into a single radiation-hardened chip, focusing on SWaP optimization for space deployment.

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