Special Notice: Cornerstone Initiative CS-19-1303 - Silicon Interposer and Advanced Integration and Packaging Technologies

U.S. Army Combat Capabilities Development Command (CCDC) Chemical Biological Center, Rock Island, IL, on behalf of the Office of the Secretary of Defense, Office of the Deputy Assistant Secretary of Defense for Industrial Policy via its Manufacturing Resiliency and Assurance Office, and Industrial Base Analysis and Sustainment Program (10 U.S.C. - 2508), in conjunction with Army Contracting Command - Rock Island (ACC-RI), manages the Cornerstone Other Transaction Agreement (OTA), in accordance with 10 U.S.C. - 2371b. Cornerstone was created to "Assess and Strengthen the Manufacturing Defense Industrial Base and Supply Chain Resiliency of the United States." ACC-RI, on behalf of CCDC Chemical Biological Center, intends to issue a competitive Cornerstone Initiative Request (CIR) for Silicon Interposer and Advanced Integration and Packaging Technologies, on or after June 12, 2019, with an estimated closing date of 10 business days after issuance. The CIR for Silicon Interposer and Advanced Integration and Packaging Technologies is restricted to Cornerstone consortium members. Offerors must have an active registration with the Joint Certification Program to be considered for award. The CIR will solicit enhanced whitepapers for one (1) fixed amount OTA with incremental payments made upon completion of specific milestones. Multiple OTAs may be awarded if found to be in the best interest of the Government. The period of performance will be 48 months. If the prototype is successful, a follow-on production transaction or contract may be awarded. This project is seeking to create prototypes using silicon interposer technology with copper-based materials to expand the industrial base for Government electronics, commercial electronics and/or Internet of things (IOT) systems through the integration of heterogeneous chips. Requirements for parameters such as size, weight, and power, reliability, radio frequency performance parameters, electrical performance parameters and cost will be included to show capability can be met using U.S.-based processes and facilities as part of this prototype effort. The CIR for Silicon Interposer and Advanced Integration and Packaging Technologies will be communicated to the Cornerstone consortium and companies with pending applications via email. Entities are required to have begun the membership process for their proposal to be reviewed. Entities must be members of the Cornerstone consortium, with a signed Cornerstone Consortium Management Agreement, to be awarded this OTA task. Contractors may obtain Cornerstone registration information by visiting the Cornerstone website: http://ibasp-public.ria.army.mil/cornerstone/ Interested parties should stay alert for any changes that may be published to this FBO posting. Please email all questions and responses to the following mailbox: usarmy.ria.ccdc-cbc.mbx.cornerstone-ota@mail.mil This Special Notice is for planning purposes only and does not constitute a CIR or an obligation on behalf of the U.S. Government. Issuance of this Special Notice is not a guarantee of a future CIR or an award and is not a commitment of any kind by the Government.