Specialized Military Packaging & Logistics
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract for Specialized Military Packaging and Logistics supports prime contractors on US Air Force F-16 ESDC projects. The scope of work involves the specialized packaging of sensitive electronics and the delivery of shipment-ready Circuit Card Assemblies. All operations must be performed at Hill Air Force Base and adhere to strict regulatory standards, including AFI 24-602V2, AFMAN 24-604, DOT Title 49 CFR, and IATA/IMDG regulations. To ensure the protection of electronic components, the contractor must utilize ESD-safe and SPIRES compliant materials in accordance with ANSI/ESD S20.20. This opportunity is managed by the Department of Defense under agency FA8212 Afsc Olh Pzaba with a response deadline of September 21, 2026.
General Info
Agency
NAICS
Place of Performance
Hill Air Force Base, UT, 84056, USASet-Aside
Documents
This scope was carved out of FD20202600262.
The full solicitation package (7 documents), including the RFP, is on the prime solicitation, not on this scope.
F-16 Circuit Card Assembly 3-Year IDIQ
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Timeline
Response Deadline
Organization & Contact Information
Full Description
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