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Specialized Packaging & Labeling Services

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract requires specialized packaging and labeling services for microcircuits in strict compliance with MIL-STD-2073-1E and MIL-STD-129 standards, ensuring military-grade durability and traceability. All packaging must incorporate proper ESD and EMI protection to safeguard sensitive components during handling and transport, and labels must clearly indicate lead finish markings as mandated by defense specifications. The work is scoped as a subcontract under the Department of Defense’s Active Devices Division, with performance required at a facility in Columbus, Ohio, with a zip code of 43213. Bidders must submit proposals by July 30, 2026, following the solicitation issued under the NAICS code 385110, which corresponds to electronic component and board manufacturing and packaging services. The posting date is July 19, 2026, and the opportunity is accessible via the DIBBS platform.

General Info

Specialized microcircuit packaging and labeling per MIL-STD-2073-1E and MIL-STD-129 in Columbus, Ohio, with ESD/EMI protection and DOD subcontract requirements.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

Place of Performance

COLUMBUS, OH, 43213, US

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
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Office AddressN/A
ContactsNo contact information available

Full Description

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Military-compliant packaging and labeling of microcircuits per MIL-STD-2073-1E and MIL-STD-129, including ESD/EMI protection and lead finish markings.

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