This Government Contract opportunity from Department Of Defense was posted on August 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Specialized Packaging and Palletization Services
Contract Overview
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AI Contract Overview
The contract requires specialized packaging and palletization services for circuit card assemblies, ensuring full compliance with DLA RP001 standards. All packaging materials must be ESD-safe to safeguard sensitive electronic components from electrostatic discharge, and physical protection measures must be implemented to prevent mechanical damage during handling and transport. The work is to be performed under a subcontract arrangement, with an emphasis on precision, reliability, and adherence to military-grade protective protocols. The requirement emphasizes the integrity of the supply chain for defense-related electronics, where even minor handling errors could compromise mission-critical systems. The solicitation is associated with the Department of Defense’s Maritime Supply Chain under NAICS code 561910, indicating specialized packaging and labeling services. The response deadline is set for August 10, 2026, with the posting date occurring on August 5, 2026, providing a limited window for qualified vendors to submit proposals. There is no designated set-aside classification, meaning all eligible subcontractors may compete. The place of performance and point of contact details are not specified, but all work must align with DLA RP001 guidelines regardless of location. Interested parties are directed to the official DIBBS portal for full solicitation details and submission procedures.
General Info
Agency
NAICS
Place of Performance
USASet-Aside
Documents
This scope was carved out of SPE7M1-26-T-8746.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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