This Government Contract opportunity from Department Of The Treasury was posted on May 4, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Supply of CTIP-III Compatible Engraved Brass Plates
Contract Overview
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The contract entails the manufacture and delivery of proprietary engraved brass plates specifically engineered to be fully compatible with the CTIP-III intaglio laser engraving system used in the production of U.S. currency. These plates are critical components in the security printing process, requiring precise dimensional and surface specifications to ensure consistent, high-fidelity reproduction of intricate design elements on banknotes. The work must meet exacting quality and technical standards to support the integrity and anti-counterfeiting features of U.S. currency. The solicitation is issued as a subcontract under the Office of the Chief Procurement Officer within the Department of the Treasury, with performance required at a facility in Washington, D.C., identified by the ZIP code 20228. The North American Industry Classification System code 332813 applies, indicating the work falls within the category of metal stamping and related manufacturing. The opportunity was posted on May 4, 2026, and responses must be submitted no later than 6:30 PM Eastern Time on May 19, 2026. While no set-aside designation or point of contact is provided, potential bidders are expected to demonstrate proven capability in precision metal engraving, familiarity with federal currency production requirements, and adherence to the technical specifications inherent in the CTIP-III system.
General Info
Agency
NAICS
Place of Performance
Washington, DC, 20228, USASet-Aside
Documents
This scope was carved out of 2031ZA26N00032.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
Notice of Intent to Sole Source CTIP III Engraved Metal Plates
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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