This Government Contract opportunity from Department Of Defense was posted on April 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Supply of Qualified Packaging Materials (QPL-Compliant)
Contract Overview
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AI Contract Overview
The contract involves the supply of Qualified Product List compliant ESD-safe packaging materials, specifically barrier bags and containers, designed to meet stringent military performance standards including MIL-PRF-131 and MIL-PRF-81705. These materials are essential for protecting sensitive electronic components from electrostatic discharge during storage and transportation within defense and aerospace applications. The scope requires adherence to established military specifications to ensure consistent quality, reliability, and compatibility with existing defense supply chains. All offerings must be sourced from approved QPL manufacturers and must demonstrate verified compliance through documentation and testing protocols. The contract is structured as a subcontract under the Department of Defense, managed by the Navsup Weapon Systems Support Mech, with performance requirements centered in Mechanicsburg. It was posted on April 30, 2026, with a firm response deadline of May 29, 2026, at 9:00 PM Eastern Time. The North American Industry Classification System code 322291 indicates the focus on other paper product manufacturing, aligning with the production of specialized packaging materials. There is no set-aside designation specified, and all interested parties must meet the technical and compliance requirements without preference for small business or other categories. Participation requires submission of fully qualified, standards-compliant products capable of integration into military logistics systems.
General Info
Place of Performance
Mechanicsburg, PA, USASet-Aside
Documents
This scope was carved out of N00104-26-R-DA78.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
59--MODULE ASSEMBLY,RIM
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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