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Supply of Raw Materials or Subcomponents for Backshell Production

Active

Federal

Response Deadline09/15/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Active Devices Division of the Department of Defense is seeking a subcontractor for the supply of military-grade raw materials and subcomponents, specifically metal alloys and insulating compounds, required for the fabrication of electrical connector backshells. All provided materials must adhere to strict specification compliance and maintain full traceability to ensure military standards are met. This subcontract opportunity is associated with NAICS code 331492 and will be performed at Hill AFB, zip code 84056-5734. The solicitation was posted on August 31, 2026, with a response deadline set for September 15, 2026.

General Info

DoD seeks subcontractor for military-grade raw materials and subcomponents at Hill AFB.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

331492 - Secondary Smelting, Refining, and Alloying of Nonferrous Metal (except Copper and Aluminum)View NAICS

Place of Performance

HILL AFB, UT, 84056-5734, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-Q-0954.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

BACKSHELL, ELECTRICAL C

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Timeline

PostedAug 31

subcontract

Response DeadlineSep 15

Submission deadline

Response Deadline

09/15/2026, 05:00:00 PM UTCin 15 days

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Supply of military-grade raw materials such as metal alloys or insulating compounds used in the fabrication of electrical connector backshells, with full traceability and specification compliance.

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