T_IME_23_FY26I - Provision of One (1) Unit of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) Barrier-Seed layers, Redistribution Layer (RDL) Barrier-Seed layers and Optional Aluminum (Al) deposition on 200mm wafers
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A*STAR Research Entities is seeking sources for the provision of one Physical Vapor Deposition PVD Cluster tool designed for 200mm wafers. The equipment must be capable of handling Through Silicon Via TSV Barrier-Seed layers and Redistribution Layer RDL Barrier-Seed layers, with an additional requirement for optional Aluminum deposition. This sources-sought solicitation, identified by number Doc2441528264, was posted on October 16, 2026. Interested parties must submit their responses by the deadline of October 30, 2026.
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